Preparation method of single-side wet-process black silicon silicon wafer

Abstract

The invention relates to a preparation method of a single-side wet black silicon wafer. The preparation method comprises the following steps of placing a plurality of silicon wafers in a paired way, wherein the distance between two silicon wafers in the paired way is 0.1-3 millimeters; performing double-side polishing on each silicon wafer by dynamic reaction to obtain a silicon wafer with doublepolished surfaces; performing single-side texturing on the silicon wafer with double polished surfaces by wet etching to obtain a silicon wafer with a single textured surface, wherein the reaction process in wet etching is allowed to be stood; and separating the silicon wafers arranged in parallel in the paired way and with single textured surfaces to obtain the single-side wet black silicon wafer. In the preparation method of the single-side wet black silicon wafer, the silicon wafers are arranged in parallel in the paired way for double-side polishing and single-side texturing, the reactionprocess in wet etching is allowed to be stood, and a texturing surface structure can be prevented from being formed on a back surface of each silicon wafer, the single-side wet black silicon wafer canbe directly obtained after separation, the texturing surface on the back surface of the silicon wafer is not needed to be subsequently removed, and the preparation method is simplified.

Description

technical field [0001] The invention relates to the technical field of silicon wafer manufacturing, in particular to a method for preparing a single-sided wet-process black silicon wafer. Background technique [0002] Black silicon technology is widely favored by polycrystalline cell manufacturers due to its good light trapping effect, can greatly improve the conversion efficiency of polycrystalline silicon wafers, and can solve the suede problem of diamond wire-cut polycrystalline silicon wafers. In the traditional trough-type wet-process black silicon, the silicon wafer is polished first, then inserted into the flower basket, immersed in the solution for texturing, so black silicon texture can be formed on both sides. However, in the manufacture of the battery, the textured structure on the back has no effect on the battery, but will affect the passivation effect of the aluminum on the back. Therefore, in the production of the battery, the black silicon texture on the back...

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to address the problem of how to simplify the wet black silicon process, and provide a method for preparing a single-sided wet black silicon wafer that can simplify the preparation method

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