Method for preparing OLED thin-film packaging layer, OLED thin-film packaging structure and OLED structure

Abstract

The embodiment of the invention discloses a method for preparing an OLED thin-film packaging layer. The method comprises the steps of depositing a first inorganic material film layer on a substrate provided with an OLED device, wherein the first inorganic material film layer completely covers the OLED device; depositing a first organic material film layer on the first inorganic material film layerthrough a plasma-enhanced chemical vapor deposition process; depositing a second organic material film layer on the first organic material film layer through an inkjet printing process; and depositing a second inorganic material film layer on the second organic material film layer. The invention further discloses a corresponding OLED thin-film packaging structure and an OLED structure. Through implementation of the embodiment of the invention, the thickness of the OLED thin-film packaging layer can be reduced.

Description

technical field [0001] The invention relates to the display field, in particular to a method for preparing an OLED thin film encapsulation layer, an OLED thin film encapsulation structure and an OLED structure. Background technique [0002] Organic light-emitting diodes (OLEDs) have attracted great attention from academia and industry because of their wide application value in solid-state lighting and flat panel displays. Among them, flexible OLED display is also an inevitable trend in the future development of the display industry. Since organic light-emitting materials are very sensitive to water and oxygen, how to effectively block the damage of external water and oxygen to OLED devices to ensure a long service life of the device is also one of the hotspots and difficulties in the current flexible OLED research. At present, the more mature flexible packaging technology is generally realized by using inorganic / organic multiple alternating thin film structures. Among them...

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Problems solved by technology

[0003] like figure 1 As shown, a schematic diagram of the organic layer structure prepared by PECVD in the prior art is shown; wherein, the inorganic material layer 2 is arranged on the OLED device 1, and the organic material layer 3 is deposited on the inorganic material layer by the PECVD process, generally Generally, the organic layer material prepared by PECVD is usually hexamethyldisiloxane (HMDSO), which has the advantage that it can coat and fix the pollution particles4 in a relatively thin thickness, and the disadvantage is the effect of flattening the substrate surface poor

[0004] figure 2 It is a schematic diagram of the structure of the organic layer prepared by IJP in the prior art; wherein, the organic material layer 3 is prepared by IJP, and it can be seen that the organic layer prepared by IJP has good polymer fluidity, so the substrate surface is flat The disadvantage is that the obtained organic layer has a good coating effect on the pollution particles only when it reaches a certain thickness. In the existing technology, in order to completely cover the pollution particles, the organic layer prepared by LJP Its thickness generally needs to reach 8-10um

As a result, the total thickness of the obtained thin film encapsulation layer is relatively thick, which is not conducive to the development of ultra-thin flexible OLED screens

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