Processing device, component conveying device, and processing method
A processing device and processing position technology, applied in the direction of auxiliary devices, electrolytic components, electrical components, etc., can solve problems such as difficult to achieve processing capacity
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no. 1 approach
[0080] Hereinafter, the first embodiment will be described.
[0081] Such as figure 1 As shown, the processing device 10 has a parts feeder 11 as a supply mechanism, a conveying device 12 as a conveying mechanism, and a laser device 13 as a processing mechanism. The processing device 10 has a plurality of laser devices 13 . In addition, in figure 1 In , two laser devices 13 are shown, but the number of processing mechanisms corresponding to the processing is provided. In the following description, when the laser devices are described one by one, reference numerals are assigned to the respective laser devices, and when the common laser devices are described, "13" is used as the reference numeral.
[0082] The parts feeder 11 sequentially feeds objects to be processed by the laser device 13 to the conveying device 12 by vibrating. The object to be processed is an element body constituting a chip-shaped electronic component. The transport device 12 transports the supplied co...
no. 2 approach
[0169] Hereinafter, a second embodiment will be described.
[0170] In addition, in this embodiment, the same code|symbol is attached|subjected to the same component as the above-mentioned embodiment, and a part or all of the description is abbreviate|omitted.
[0171] Such as Figure 13 As shown in (a), the processing apparatus 100 has the parts feeder 11, the conveyance apparatus 112, and the laser apparatus 13 which are processing apparatuses. exist Figure 13 In (a), three laser devices 13 are shown. In addition, the straight line connecting the laser device 13 and the conveying device 112 indicates the relationship between the laser device 13 and the conveying device 112 , and does not indicate the processing position performed by the laser device 13 .
[0172] The conveying device 112 has a conveying rotor 120 and a rotating shaft 120 a supporting the conveying rotor 120 . In the present embodiment, the rotating shaft 120a is vertically supported on the main body por...
no. 3 approach
[0188] Hereinafter, a third embodiment will be described. The chip-shaped electronic component processed in this embodiment is different in shape from the electronic component 70 processed in the first and second embodiments.
[0189] Such as Figure 15As shown, the processing device 210 has a parts feeder 211 as a supply mechanism, a conveying device 212 as a conveying mechanism, and a laser device 213 as a processing mechanism. The processing device 10 has a plurality of laser devices 213 . In addition, in Figure 15 In , two laser devices 213 are shown, but the number of processing mechanisms corresponding to the processing is provided. In the following description, when the laser devices are described one by one, reference numerals are assigned to the respective laser devices, and when the common laser devices are described, "213" is used as the reference numeral. In addition, in this embodiment, an example of a "component conveying apparatus" is comprised using the co...
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