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Vibration wave roll and microsphere loading device for reflecting material

A vibratory wave and microbead technology, which is applied in lamination devices, chemical instruments and methods, lamination auxiliary operations, etc., can solve the problem of weak adhesion of the glue surface, excessive amount of reflective microbeads, scratches or tears of the substrate And other problems, to achieve the effect of improving viscosity, short duration and strong strength

Pending Publication Date: 2018-04-13
金华易翔新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the beads are attached to the rubber surface, there will be some redundant reflective beads, which are not firmly attached to the rubber surface, and the amount of reflective beads carried on the substrate is also too large, so the operator needs to add one more to the production line. Vibration device to shake off excess reflective beads
[0004] The vibration method currently used is to use artificial hammering on the surface of the substrate to shake off the reflective beads, but the substrate is in a state of transportation, so there is a certain relative movement between the hammering point and the substrate when hammering. Difficult to move quickly and if transported quickly would allow points of contact to nick or tear the substrate

Method used

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  • Vibration wave roll and microsphere loading device for reflecting material
  • Vibration wave roll and microsphere loading device for reflecting material
  • Vibration wave roll and microsphere loading device for reflecting material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Such as figure 1 A microbead feeding device for reflective materials is shown, including a base material, a conveying roller for transporting the base material, a heating device 1, a bead holding hopper 2 and a removal mechanism for shaking off excess microbeads, The removal mechanism includes a longitudinal movement structure and a vibrating roller for maintaining the vertical movement of the substrate;

[0034] The heating device 1 is used to irradiate and heat the glue on the surface of the substrate; the surface of the substrate with the glue faces the heating device 1, and the heating device 1 is located in front of the bead hopper 2; the substrate heated by the heating device 1 rapidly Enter into the micro-bead hopper 2, the micro-bead hopper 2 is filled with a large amount of reflective micro-beads, after the surface of the substrate is heated, the glue adheres to a large number of reflective micro-beads; At the wave sending end, the vertical movement structure ...

Embodiment 2

[0040] This embodiment is based on Embodiment 1, which is optimized.

[0041] Such as Figure 6 and Figure 7 As shown, in Embodiment 2, the middle part of the vibrating part 40 is recessed to form a recess, and the recess direction of the recess is opposite to the rotation direction of the roller body 3 . The outer end of the vibrating part 40 is arc-shaped, and the arc-shaped opening at the outer end of the vibrating part 40 communicates with the concave part.

[0042] Through the concave part of the vibration part 40 and the arc-shaped opening at the outer end of the vibration part 40, the airflow is concentrated in the concave part where there is an arc-shaped opening to extrude the airflow, so that the airflow is more concentrated, and the impact points on the substrate are more concentrated to avoid The air flow is dispersed.

[0043] Such as Figure 7As shown, the vibrating part 40 is provided with a fixing hole 402, and the vibrating part 40 is provided with a coun...

Embodiment 3

[0051] Such as Figure 4 As shown, the vibration wave device 4 is a fiber cloth bundled on the surface of the roller body 3, and the vibration wave part 40 is the extra cloth after bundling.

[0052] The vibrating part 40 in this embodiment is extra fiber cloth, even on the basis of the vibrating part 40, cloth pieces can be bundled to increase the weight of the vibrating part 40 and improve the airflow impact of the vibrating part 40.

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PUM

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Abstract

The invention discloses a microsphere loading device for a reflecting material. The microsphere loading device for the reflecting material comprises a base material, a conveying roll, a thermalizationdevice, a microsphere containing funnel and a residue removal mechanism; the residue removal mechanism comprises a longitudinal movement structure and a vibration wave roll; the thermalization deviceis used for illuminating and heating an adhesive on the surface of the base material; the microsphere containing funnel is used for that the adhesive is adhered to a reflective microsphere after thesurface is thermalized after the base material enters the microsphere containing funnel; one end, rotating downwards along with a roll body, of a vibration wave part is a vibration wave sending end; the vibration wave sending end faces the surface, to which the reflective microsphere is not adhered, of the base material; the vibration wave roll comprises the roll body and a vibration wave device and comprises a fixing part, a connection part and the vibration wave part; the vibration wave part is sheet bar-shaped or stripped, the connection part is connected with the fixing part and the vibration wave part, the connection part is flexible movement connection part, the fixing part is connected with the roll body; and the fixing part and the roll body synchronously rotate. For the microsphere loading device, the vibration wave part is driven by the roll body to rotate to form an interval high-speed air flow, and the air flow impacts the surface of the base material at a high frequency, so that the base material rapidly vibrates under the condition without contact, and redundant reflective microspheres on the surface of the base material are automatically shaken off.

Description

technical field [0001] The invention relates to a feeding device for reflective materials, in particular to a vibrating roller and a microbead feeding device for reflective materials. Background technique [0002] In the preparation process of reflective materials, such as figure 1 As shown, the substrate needs to pass through the dipping device 5 and the drying device 6 in sequence to form a layer of adhesive surface on the surface of the dipping device 5 , and then the moisture in the glue is dried by the drying device 6 . [0003] Afterwards, the substrate with the glue surface enters into the reflective microbeads, and the reflective microbeads are attached to the glue surface of the substrate through the glue surface. However, after the beads are attached to the rubber surface, there will be some redundant reflective beads, which are not firmly attached to the rubber surface, and the amount of reflective beads carried on the substrate is also too large, so the operator...

Claims

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Application Information

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IPC IPC(8): B32B37/10B32B37/12B32B37/14B32B38/00
CPCB32B37/10B32B37/1045B32B37/12B32B37/14B32B38/00
Inventor 黄勤
Owner 金华易翔新材料科技有限公司
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