Vibration wave roll and microsphere loading device for reflecting material

A vibratory wave and microbead technology, which is applied in lamination devices, chemical instruments and methods, lamination auxiliary operations, etc., can solve the problem of weak adhesion of the glue surface, excessive amount of reflective microbeads, scratches or tears of the substrate And other problems, to achieve the effect of improving viscosity, short duration and strong strength

Pending Publication Date: 2018-04-13
金华易翔新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, after the beads are attached to the rubber surface, there will be some redundant reflective beads, which are not firmly attached to the rubber surface, and the amount of reflective beads carried on the substrate is also too large, so the operator needs to add one more to the production line. Vibration device to shake off excess reflective beads
[0004] The vibration metho

Method used

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  • Vibration wave roll and microsphere loading device for reflecting material
  • Vibration wave roll and microsphere loading device for reflecting material
  • Vibration wave roll and microsphere loading device for reflecting material

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0032] Example 1:

[0033] like figure 1 A microbead feeding device of a reflective material as shown, includes a substrate, a conveying roller for conveying the substrate, a heating device 1, a microbead hopper 2 and a surplus removal mechanism for shaking off excess microbeads, The excess removal mechanism includes a longitudinal movement structure and a vibration roller for maintaining the vertical movement of the substrate;

[0034] The heating device 1 is used to irradiate and heat the adhesive on the surface of the substrate; the substrate with the adhesive surface faces the heating device 1, and the heating device 1 is located in front of the microbead hopper 2; the substrate heated by the heating device 1 quickly Entering into the microbeads and microbeads hopper 2, the microbeads hopper 2 contains a large number of reflective microbeads. After the surface of the substrate is heated, the adhesive adheres to a large number of reflective microbeads; At the wave sending...

Example Embodiment

[0039] Example 2:

[0040] This embodiment is based on Embodiment 1, which is optimized.

[0041] like Image 6 and Figure 7 As shown, in Embodiment 2, the center of the vibration wave portion 40 is recessed to form a recess, and the recessed direction of the recess is opposite to the rotation direction of the roller body 3 . The outer end of the vibrating wave portion 40 is arc-shaped, and the arc-shaped opening at the outer end of the vibrating wave portion 40 communicates with the concave portion.

[0042] Through the concave portion of the vibrating wave portion 40 and the arc-shaped opening at the outer end of the vibrating wave portion 40, the airflow is concentrated at the arc-shaped opening in the concave portion and the airflow is squeezed out, so that the airflow is more concentrated, and the impact point on the substrate is more concentrated, avoiding Air flow is dispersed.

[0043] like Figure 7As shown, the vibrating wave part 40 is provided with a fixing h...

Example Embodiment

[0050] Example 3:

[0051] like Figure 4 As shown, the vibrating wave device 4 is the fiber cloth bundled on the surface of the roller body 3. The vibrating wave formed by the cloth bundled by the vibrating wave part 40 is similar to that of the first embodiment.

[0052] The vibrating wave part 40 in this embodiment is made of extra fiber cloth, and the weight of the vibrating wave part 40 can even be increased by bundling cloth sheets or the like on the basis of the vibrating wave part 40 to improve the airflow impact of the vibrating wave part 40 .

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PUM

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Abstract

The invention discloses a microbead feeding device for reflective materials, which comprises a base material, a conveying roller, a thermalization device, a microbead storage hopper and a residual removal mechanism, and the residual removal mechanism includes a longitudinal moving structure and a vibration roller; the thermalization device is used It is used to irradiate and heat the adhesive on the surface of the substrate; the bead hopper is used for the adhesive to adhere to the reflective microbeads after the substrate enters and the surface is heated; the end of the vibration part that rotates downward with the roller body is the vibration sending end, The wave sending end faces the surface of the substrate without reflective microbeads attached. The vibrating roller includes a roller body and a vibrating device, including a fixed part, a connecting part and a vibrating part. The vibrating part is in the shape of a plate or a strip, and the connecting part connects the fixed part and the vibrating part. The connecting part is an overall flexible activity The connecting part and the fixing part are connected with the roller body and the two rotate synchronously. The roller body drives the vibration part to rotate, forming a high-speed airflow in the gap, and the high-frequency airflow impacts the surface of the substrate, causing the substrate to vibrate rapidly without contact, and the redundant reflective beads on the surface of the substrate are automatically shaken off.

Description

technical field [0001] The invention relates to a feeding device for reflective materials, in particular to a vibrating roller and a microbead feeding device for reflective materials. Background technique [0002] In the preparation process of reflective materials, such as figure 1 As shown, the substrate needs to pass through the dipping device 5 and the drying device 6 in sequence to form a layer of adhesive surface on the surface of the dipping device 5 , and then the moisture in the glue is dried by the drying device 6 . [0003] Afterwards, the substrate with the glue surface enters into the reflective microbeads, and the reflective microbeads are attached to the glue surface of the substrate through the glue surface. However, after the beads are attached to the rubber surface, there will be some redundant reflective beads, which are not firmly attached to the rubber surface, and the amount of reflective beads carried on the substrate is also too large, so the operator...

Claims

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Application Information

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IPC IPC(8): B32B37/10B32B37/12B32B37/14B32B38/00
CPCB32B37/10B32B37/1045B32B37/12B32B37/14B32B38/00
Inventor 黄勤
Owner 金华易翔新材料科技有限公司
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