Camera module encapsulation process and structure

Abstract

The invention discloses a camera module encapsulation process and structure. The encapsulation process comprises the following steps: encapsulating a light filter on a photosensitive area of a photosensitive chip; connecting the photosensitive chip and a component to a module substrate; injection-molding an annular plastic layer on the module substrate, wrapping the component in the annular plastic layer and wrapping the photosensitive chip and the light filter from the circumference; and loading a lens on the annular plastic layer. The above process is the improvement of the existing CSP process, the light filter is directly used for encapsulating the photosensitive chip at the beginning of the manufacturing process, thereby avoiding the pollution on the photosensitive area of the photosensitive chip in the subsequent manufacturing process, and an operation of adding additional encapsulation structure is unnecessary; the process is simpler, the bad influence on the image effect by theencapsulation structure is avoided, and the aims of conveniently controlling the manufacturing process and improving the yield are achieved.

Description

technical field [0001] The invention relates to the technical field of camera module packaging, in particular to a camera module packaging process and structure. Background technique [0002] At present, there are two main production processes for camera modules. One is the COB process, which uses bare chip packaging. The bare chip is fragile and easily contaminated. The process is very difficult to control and the production yield is low, so it is currently difficult to Really achieve mass production; the other is the CSP process, which adds a packaging layer on the bare chip, but due to slight refraction, reflection and energy loss when light penetrates the packaging layer, its image effect is not directly used with the bare chip. The module made by advanced COB technology has good effect. [0003] Therefore, how to improve the current module manufacturing process so that it can reduce the risk of bare chip contamination, facilitate process control, improve yield, and at ...

AI Technical Summary

Problems solved by technology

[0002] At present, there are two main production processes for camera modules. One is the COB process, which uses bare chip packaging. The bare chip is fragile and easily contaminated. The process is very difficult to control and the production yield is low, so it is currently difficult to Really achieve mass production; the other is the CSP process, which adds a packaging layer on the bare chip, but due to slight refraction, reflection and energy loss when light penetrates the packaging layer, its image effect is not directly used with the bare chip. The module made by advanced COB technology has good effect

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