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Structure for matching side plate with water chamber of heat radiator

A matching structure and radiator technology, applied in heat exchanger shells, heat exchange equipment, lighting and heating equipment, etc., can solve the problems of increased manufacturing costs, complex structural design, complex production process, etc., to reduce manufacturing costs , Reasonable structural design and simple production process

Pending Publication Date: 2018-04-17
SHANDONG TONGCHUANG AUTO COOLING SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical task of the present invention is to address the above deficiencies, to provide a radiator side plate and water chamber matching structure, which can solve the complex structure design, complex production process, many processing procedures in the prior art, and cannot be formed at one time, which increases the manufacturing cost. The problem

Method used

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  • Structure for matching side plate with water chamber of heat radiator
  • Structure for matching side plate with water chamber of heat radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A radiator side plate and water chamber matching structure of the present invention, the two ends of the side plate 1 are respectively provided with limit baffles 3, the two ends of the water chamber 2 are opening structures, and the outer edge of the opening is provided with a limit stop The notch groove 4 matched with the plate 3, the limit baffle 3 is clamped in the notch groove 4, and the limit baffle 3 and the notch groove 4 are fixedly connected by brazing; the cross-sectional shape of the side plate 1 It is a U-shaped structure, and the limit baffle 3 is arranged parallel to the outer wall of the side plate 1 and located on the same plane.

Embodiment 2

[0023] A radiator side plate and water chamber matching structure of the present invention, the two ends of the side plate 1 are respectively provided with a convex-shaped limit baffle 3, the two ends of the water chamber 2 of the rectangular square tube structure are opening structures, the opening There is a notch groove 4 matched with the limit baffle 3 on the outer edge, the limit baffle 3 is clamped in the notch groove 4, and the limit baffle 3 and the notch groove 4 are brazed Fixed and connected; the cross-sectional shape of the side plate 1 is a U-shaped structure, and the limit baffle 3 is arranged parallel to the outer wall of the side plate 1 and located on the same plane.

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Abstract

The invention discloses a structure for matching a side plate with a water chamber of a heat radiator and belongs to the technical field of heat radiator parts. The technical problem to be solved by the invention is to solve the problems of complicated structure design, complicated production process, multiple machining processes, incapability of achieving one-time forming and the increase of production cost in the prior art. The technical scheme adopted by the invention is as follows: limiting baffles are arranged at two ends of the side plate respectively; two ends of the water chamber are opening structures; notch grooves matched with the limiting baffles are formed in the outer edges of the openings; the limiting baffles are clamped in the notch grooves; and the limiting baffles are fixedly connected with the notch grooves through brazing. The structure is simple in structure design and few in machining processes, and has the advantage of capability of achieving one-time forming.

Description

technical field [0001] The invention relates to the technical field of radiator components, in particular to a radiator side plate and water chamber matching structure. Background technique [0002] Integrated circuits are widely used in electronic equipment components, and high temperature is the enemy of integrated circuits. Integrated circuit components will generate high temperature during operation, which will lead to unstable operation of the system of electronic equipment, shorten the life of electronic equipment, and even cause some components to burn out. The heat that causes high temperature comes from inside the electronic device or inside the integrated circuit. The function of the radiator is to absorb the heat and then dissipate it outside the chassis to realize the cooling function. There are many types of radiators, which can be divided into air-cooled, water-cooled, semiconductor refrigeration, compressor refrigeration, etc. according to the heat dissipatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F9/02
CPCF28F9/02
Inventor 马文明徐浩安宝霞赵旺亮桑鲁斌孔会
Owner SHANDONG TONGCHUANG AUTO COOLING SYST
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