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A topology of mmc modules applied to flexible direct current transmission systems

A technology of power transmission system and topology structure, applied in the field of MMC module topology structure, can solve the problems of loss, topology structure cannot effectively block DC faults, etc., and achieve the effect of suppressing fault current

Active Publication Date: 2019-12-17
TBEA SUNOASIS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the MMC module topology formed by cascading half-bridge sub-modules cannot effectively block DC faults. Therefore, once a DC fault occurs, electronic devices such as transistors and diodes will inevitably be burned, causing great losses.

Method used

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  • A topology of mmc modules applied to flexible direct current transmission systems
  • A topology of mmc modules applied to flexible direct current transmission systems
  • A topology of mmc modules applied to flexible direct current transmission systems

Examples

Experimental program
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Effect test

Embodiment 1

[0023] Such as figure 1 As shown, this embodiment provides a MMC (ModularMultilevel Converter, Modular Multilevel Converter) module topology applied to a flexible direct current transmission system, which includes three phase units, namely A phase unit and B phase unit As for the C-phase unit, each phase unit includes an upper bridge arm and a lower bridge arm. The upper bridge arm and the lower bridge arm of each phase unit have the same structure, and both include reactors L and n sub-modules connected in series in sequence. The number of sub-modules in each phase unit is determined by factors such as the DC bus voltage, the withstand voltage level of electronic devices, and the type of sub-modules at the beginning of the system design. In this embodiment, the number of sub-modules of each phase unit m=2n=Udc / U SM , where Udc is the voltage between the positive and negative DC bus, U SM is the capacitor voltage of each sub-module, n is the number of sub-modules on each bri...

Embodiment 2

[0041] Such as figure 2 As shown, this embodiment provides a sub-module. In the first unit 1 of the sub-module, the collector of the transistor VT1 is respectively connected to the cathode of the diode VD1 and the anode of the capacitor C11, and the emitter of the transistor VT1 is respectively connected to the diode VD1. The positive pole is connected to the collector of the transistor VT2, the collector of the transistor VT2 is also connected to the negative pole of the diode VD2, the emitter of the transistor VT2 is respectively connected to the positive pole of the diode VD2, and the negative pole of the capacitor C11, and the output terminal A is connected to the emitter of the transistor VT1 and The connection points of the collectors of the transistor VT2 are connected;

[0042] In the second unit 2 of the sub-module, the collector of the transistor VT3 is respectively connected to the cathode of the diode VD3 and the anode of the capacitor C22, the emitter of the tran...

Embodiment 3

[0083] Such as Figure 5 As shown, this embodiment provides a sub-module. In the first unit 1 of the sub-module, the collector of the transistor VT1 is respectively connected to the cathode of the diode VD1 and the anode of the capacitor C11, and the emitter of the transistor VT1 is respectively connected to the diode VD1. The positive pole is connected to the collector of the transistor VT2, the collector of the transistor VT2 is also connected to the negative pole of the diode VD2, the emitter of the transistor VT2 is respectively connected to the positive pole of the diode VD2, and the negative pole of the capacitor C11, and the output terminal A is connected to the emitter of the transistor VT1 and The connection points of the collectors of the transistor VT2 are connected;

[0084] In the second unit 2 of the sub-module, the collector of the transistor VT3 is respectively connected to the cathode of the diode VD3 and the anode of the capacitor C22, the emitter of the tran...

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Abstract

The invention provides an MMC module topology applied to a flexible direct current transmission system, which includes three phase units, each phase unit includes an upper bridge arm and a lower bridge arm, and each phase unit has an upper bridge arm and a lower bridge arm. Including a series reactor and a plurality of sub-modules, each sub-module includes a first unit, a second unit, and a blocking unit and a guiding unit connected between the two, the first unit and the second unit One of them includes a canceling capacitor, and the topological structure also includes a control unit, which is used to judge whether a DC fault occurs in the system, and to control the blocking unit of each sub-module to close when it is judged that a DC fault occurs in the system, so that the fault current flows sequentially After passing through the second unit, the leading unit and the first unit of each sub-module, it flows into the fault point, and the canceling capacitor is located on the fault current path for suppressing the fault current. The invention can effectively reduce the fault current when a DC fault occurs, and avoid burning electronic devices therein.

Description

technical field [0001] The invention relates to the technical field of flexible direct current transmission and distribution, in particular to an MMC module topology applied to a flexible direct current transmission system. Background technique [0002] Flexible DC transmission technology is an important part of building a smart grid. Compared with traditional power transmission methods, flexible DC transmission has strong technical advantages in island power supply, urban distribution network expansion and transformation, AC system interconnection, and large-scale wind farm grid connection. It is a strategy to change the development pattern of large power grids. choose. [0003] Among them, compared with the traditional Voltage Source Converter (Voltage Source Converter, VSC), the Modular Multilevel Converter (Modular Multilevel Converter, MMC) has good scalability, small harmonics, low switching It has the advantages of less requirements for consistent triggering, and is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M7/483
CPCH02M7/483H02M7/4835
Inventor 李战龙刘伟增郝翔侯丹
Owner TBEA SUNOASIS
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