Underwater automatic silicon wafer loading device

Abstract

The invention discloses an underwater automatic silicon wafer loading device which can replace manual wafer taking, reduce working strength of workers, and meanwhile is simple in structure and convenient to install. The underwater automatic silicon wafer loading device comprises a support base on which a silicon wafer conveying belt and an installation rack are arranged, wherein a fixing board isarranged on the installation rack, and a first idler wheel, a second idler wheel and a suction cup are arranged on the fixing board; a silicon wafer loading frame is arranged under the fixing board; asupport board is arranged at the front end of the silicon wafer loading frame, and the support plate is provided with a shower nozzle on at least one side; the spraying center of the shower nozzle ispositioned on the length extension line of the upper surface of the silicon wafer conveying belt; a sliding chute extending along the length direction of the silicon wafer loading frame is arranged at one end, close to a silicon wafer conveyer belt, of the bottom surface of the silicon wafer loading frame; and a jacking device is arranged under the support base, the jacking device is provided with a mandrel, and the mandrel extends into the siding chute after passing through the support base. By using the underwater automatic silicon wafer loading device, the cost can be reduced, and the product quality can be improved.

Description

technical field [0001] The invention relates to cleaning of silicon wafers, in particular to an automatic underwater feeding device for silicon wafers. Background technique [0002] It is well known that after silicon rods are cut by diamond wire to form silicon wafers, degumming needs to be carried out. After the degumming is completed, the silicon wafers need to be divided into pieces, and then the pieces are inserted into flower baskets, and then subsequent cleaning and other processes are performed; in the prior art , the steps of slicing silicon wafers and inserting them into flower baskets are basically done manually, so the operating workers are less efficient during the operation, and the operators are vulnerable to injury, silicon wafers are easily damaged, and silicon wafers are vulnerable to damage. pollute. [0003] In the prior art, such as: Chinese patent application ZL201020515093.9, this utility model discloses a solar silicon wafer wet automatic slicing dev...

AI Technical Summary

Problems solved by technology

[0004] Although the above-mentioned device can achieve the separation and transportation of stacked silicon wafers, its structure is complex and requires high installation accuracy between each device, especially the height of the two hydraulic nozzles and the inclination angle of the conveyor belt. If there is an error, in the process of slicing, it is easy to fail to realize slicing or missing pieces, which is not conducive to installation. At the same time, the structure is complicated and the manufacturing cost is high.

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