Vacuum chuck and process chamber

Abstract

The invention provides a vacuum chuck and a process chamber. The vacuum chuck is used for bearing a substrate, a vacuum channel is formed in the vacuum chuck, and an edge channel is further formed inthe vacuum chuck; an air inlet of the edge channel is connected with a purging air source, an air outlet of the edge channel is formed in the position close to the edge position of the substrate, andpurging air provided by the purging air source purges the edge of the substrate in a preset air pressure; and the preset air pressure is greater than the air pressure in the environment above the substrate. According to the vacuum chuck, damage to the substrate or occurrence of scrap substrates can be avoided, contamination of the vacuum chuck can further be avoided to a certain extent, and the life of the vacuum chuck is prolonged accordingly.

Description

technical field [0001] The invention belongs to the technical field of semiconductor equipment manufacturing, and in particular relates to a vacuum chuck and a process chamber. Background technique [0002] In the manufacturing process of an integrated circuit (IC), especially in a chemical vapor deposition (CVD) process, in order to avoid movement or dislocation during the process, a vacuum chuck (Vacuum Chuck) is often used. The vacuum chuck uses vacuum force to fix the substrate. The pressure above the vacuum chuck is the chamber pressure P1, and the bottom is the back blowing pressure P2. It should be ensured that P1>P2 can ensure the substrate is fixed. The vacuum fixing method is the same as the mechanical method. It has the following advantages: first, it can avoid irreparable damage to the substrate due to mechanical reasons such as pressure and collision; second, it can increase the effective processing area of ​​the substrate; third, it can reduce particle pollu...

AI Technical Summary

Problems solved by technology

[0004] However, it is found in practical applications that the process gas will not only react and adhere to the substrate S, but also on the vacuum chuck 103 and the gap between the vacuum chuck 103 and the substrate S, and even on the substrate S. Reaction or deposition on the back side, thereby affecting the life of the vacuum chuck 103 and causing substrate damage or even waste

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