Multi-camera module

Abstract

The embodiment of the invention discloses a multi-camera module, which comprises a bare chip, a packaging substrate and a module substrate. A side-edge bonding pad is arranged on the outer side edge of the packaging substrate, and a welding material is arranged on the side-edge bonding pad. The peripheral dimension of the packaging substrate is larger than that of the bare chip. The size difference of the packaging substrate and the bare chip does not exceed a preset threshold value. The bare chip is arranged on the packaging substrate. The functional pins of the bare chip are connected to theside-edge bonding pad through the semiconductor lead process, so that a packaging chip is formed. The packaging chip is attached to the surface of the module substrate, and is connected with the welding bonding pad of the module substrate through the side-edge bonding pad of the packaging chip. The image effect of the multi-camera module prepared by the method is equivalent to that of a module manufactured by the COB packaging technology. However, bonding gold wires in the traditional COB packaging process are avoided. The equipment investment of a production line is less, and the manufacturing cost is lower. The size of the whole multi-camera module is reduced, and the miniaturization trend development of the multi-camera module is facilitated.

Description

Technical field [0001] The embodiment of the present invention relates to the technical field of packaged photographic equipment, and particularly relates to a multi-camera module. Background technique [0002] As users have higher and higher requirements for the quality of imaged pictures, the continuous development of camera and photography equipment technology is forced to obtain high-quality, high-resolution pictures. [0003] The optical quality of the lens and the size of the sensor determine the image quality of the camera, and with the light and thin requirements of camera equipment (such as mobile terminals), the size of the sensor and the optical quality of the lens are limited. In addition, the pixels of a single camera face a bottleneck as it develops high, and it is impossible to obtain high-quality pictures by increasing the pixels. For example, for a mobile phone camera, 20 million pixels have reached the limit. In addition, users do not need mobile phones to achiev...

AI Technical Summary

Problems solved by technology

The photosensitive chip is connected to the multi-camera module by bonding gold wires, and a certain distance needs to be designed with other components of the module. Please refer to figure 1 As shown, the distance between capacitors and other devices and COB chips is larger than that of CSP chips, and the overall volume of COB packaging process modules will be larger than that of CSP process modules; and COB packaging process is used to manufacture modules, and COB bonding gold wire equipment needs to be invested. Each piece of equipment is at the million-level level, and the establishment of a COB process production line requires huge capital investment, and the manufacturing cost of camera modules is relatively high

Images