Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-intensity intelligent public transport card shell

A smart bus card, high-strength technology, applied in the direction of sealed casing, casing/cabinet/drawer parts, electrical equipment casing/cabinet/drawer, etc., can solve the problem of bending, chip damage, easy loss, etc. problem, achieve the effects of slowing down distortion, preventing chip damage, and improving buffer protection

Inactive Publication Date: 2018-05-04
范亦能
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When most passengers use bus IC cards, they usually carry them with them and put them in their trouser pockets or wallets for easy use; however, due to their small size and thin thickness, bus IC cards are easy to lose or be bent when carrying them. , which in turn causes the bus IC card shell to break and the chip in the card to be damaged

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-intensity intelligent public transport card shell

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Such as figure 1 As shown, this embodiment includes an upper casing 1 and a lower casing 2, and the upper casing and the lower casing 2 are connected to each other by rubber blocks 4 to form a closed cavity, and a chip 3 is fixed in the cavity, and the chip 3 and the cavity are provided with fillers 5, and two elastic connecting parts 6 are respectively provided on the outer walls of the upper casing 1 and the lower casing 2, and the width of the connecting parts 6 is the total width of the upper casing 1. a quarter of the width. The work of the present invention is an improvement to the existing bus IC card shell, and the upper casing 1, the lower casing 2 and the rubber block 4 are surrounded to form a cavity, the cavity is provided with a filler 5, and the bus chip 3 is placed In the center of the cavity, when the IC card is impacted or dropped from a high place, the filler 5 can play a certain role in buffering and protecting the chip 3 to avoid damage to the chip ...

Embodiment 2

[0023] Such as figure 1 As shown, in this embodiment, on the basis of Embodiment 1, the four connecting parts 6 are arranged symmetrically on the outer walls of the upper casing 1 and the lower casing 2 centering on the cavity. Four elastic connecting parts 6 are symmetrically distributed in pairs on the upper casing 1 and the lower casing 2. When the surface of the IC card is impacted by an external force, the elastic recovery of the connecting parts 6 can be superimposed to the maximum, and the direction is consistent with the direction of the external force. On the contrary, to the greatest extent offset the distortion caused by the external force acting on the card surface.

[0024] Preferably, the cross section of the connecting portion 6 is wavy. The connection portion 6 with a wavy cross section can generate a relatively large amount of deformation per unit area, which can further improve the buffer protection of the upper shell 1 and the lower shell 2 .

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a high-intensity intelligent public transport card shell. The high-intensity intelligent public transport card shell comprises an upper shell and a lower shell; the upper shelland the lower shell are connected mutually through a rubber block to form a sealed cavity; a chip is fixed in the cavity; a filler is arranged between the chip and the cavity; two elastic connectingparts are arranged on the outer walls of the upper shell and the lower shell respectively; and the width of the connecting parts is 1 / 4 of the total width of the upper shell. When an IC card is to bedeformed in suffering from external force which is perpendicular to the card surface or has a certain angle with the card surface, the two elastic connecting parts arranged on the outer walls of the upper shell and the lower shell respectively can be deformed along with the external force direction so as to relieve torsion of the overall card surface caused by the external force; and meanwhile, the rubber block between the upper shell and the lower shell is compressed under stress, and in the deformation recovery process, the elastic connecting parts are assisted to reduce the torsion degree on the card surface to the minimum, and damage of the chip caused by over torsion of the IC card can be further prevented.

Description

technical field [0001] The invention relates to the field of mobile communication, in particular to a high-strength smart bus card casing. Background technique [0002] IC card refers to integrated circuit card. The bus card we generally use is a kind of IC card. Generally, common IC cards use radio frequency technology to communicate with IC card readers. There is a difference between IC cards and magnetic cards. The card stores information through the integrated circuit in the card, while the magnetic card records information through the magnetic force in the card. The cost of the IC card is generally higher than that of the magnetic card, but the confidentiality is better. The bus IC card is a kind of non-contact data card, it is through the chip integrated in the card through the inductance coil on the card (the inductance coil is also a coil made of copper wire) at both ends of the coil through various The function of the circuit makes the induced current become DC, an...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K5/02H05K5/06
CPCH05K5/0217H05K5/069
Inventor 范亦能
Owner 范亦能
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products