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Full-automatic semiconductor material grinding equipment

A semiconductor, fully automatic technology, used in grinding/polishing equipment, grinding devices, grinding machine tools, etc., can solve problems such as low grinding efficiency, and achieve the effect of simple structure and convenient operation

Active Publication Date: 2018-05-15
JIANGSU BAO PU LAY SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Semiconductor materials are a class of materials with semi-conductive properties, which can be used to make semiconductor devices and electronic materials for machine tool circuits. No matter from the perspective of technology or economic development, the importance of semiconductors is very huge, so the application is very important. Widely, during the production and manufacturing process of semiconductor materials, the surface needs to be ground. At present, the grinding equipment for semiconductor materials has low grinding efficiency. Therefore, an efficient grinding equipment for semiconductor materials is needed.

Method used

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Embodiment Construction

[0010] like Figure 1-Figure 2 As shown, a fully automatic semiconductor material grinding equipment of the present invention includes a grinding frame 60 fixedly installed on the right end surface of the movable manipulator 50, and the inner wall of the grinding frame 60 is provided with a transmission chamber 613 and the grinding machine A telescoping cavity 637 on the lower end surface of the frame 60, a guide cavity 621 is provided between the transmission cavity 613 and the telescopic cavity 637, a rotating cavity 640 is arranged in the inner wall of the grinding machine frame 60 at the top of the telescopic cavity 637, The top of the transmission chamber 613 extends left and right with a rotating rod 643 , the rotating rod 643 is rotationally connected with the left and right end walls of the transmission chamber 613 , and the left extension end of the rotating rod 643 is dynamically connected with a rotating motor 616 The outer surface of the rotating motor 616 is fixed...

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Abstract

The invention discloses full-automatic semiconductor material grinding equipment. The equipment comprises a grinding frame fixedly mounted on the right end surface of a movable manipulator; a transmission cavity and an extension cavity penetrating through the lower end surface of the grinding frame are formed in the inner wall body of the grinding frame; a guide cavity is formed between the transmission cavity and the extension cavity; a rotating cavity is formed in the inner wall body of the grinding frame at the top of the extension cavity; a rotating rod, extending left and right, is arranged at the top of the transmission cavity; the rotating rod is in rotary fit connection with the left and right side end walls of the transmission cavity; the extension tail end of the left side of therotating rod is in power fit connection with a rotating motor; the outer surface of the rotating motor is fixedly mounted in the inner wall body of the grinding frame; and the right side of the rotating rod extends into the rotating cavity, and a first bevel gear is fixedly mounted at the tail end. The equipment enables a grinding rotating wheel to perform up-down reciprocating swing for grindingwhen rotationally grinding semiconductor materials to achieve high grinding efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductor material processing, in particular to a fully automatic semiconductor material grinding equipment. Background technique [0002] Semiconductor materials are a class of materials with semiconducting properties, which can be used to make semiconductor devices and electronic materials for machine tool circuits. No matter from the perspective of technology or economic development, the importance of semiconductors is very huge, so the application is very important. Widely, during the manufacturing process of semiconductor materials, the surface needs to be ground. The current grinding equipment for semiconductor materials has low grinding efficiency. Therefore, an efficient grinding equipment for semiconductor materials is needed. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a fully automatic semiconductor material grinding equipme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00B24B47/12
CPCB24B37/00B24B47/12
Inventor 朱江帆
Owner JIANGSU BAO PU LAY SEMICON