Installation fixing structure of independent packaging type radio-frequency power amplifier chip

Abstract

The invention provides an installation fixing structure of an independent packaging type radio-frequency power amplifier chip, mainly comprising a supporting seat, an adjusting piece, a large flat-head adjusting jackscrew and small flat-head adjusting jackscrews. The supporting seat is inverted-U-shaped, and a power amplifier chip, the adjusting piece, the adjusting jackscrews and fastening screwsare contained in the supporting seat after installation. The adjusting piece is clamped between an adjusting seat and the chip through a limiting table. The large and small flat-head adjusting jackscrews are combined in use, and are alternately tightened during installation. The installation fixing structure of the invention has strong applicability, and can be applied to the installation fixingof both a flange-type power amplifier chip and a non-flange-type power amplifier chip. For a flange-type power amplifier chip, the grounding performance, the heat dissipation performance and the anti-shock and vibration performance can be improved. For a non-flange-type power amplifier chip, the assembly difficulty of the power amplifier chip can be reduced and the maintainability of the amplifiercan be improved while the grounding performance, the heat dissipation performance and the anti-shock and vibration performance are ensured.

Description

technical field [0001] The invention relates to the field of power amplifiers, in particular to a mounting and fixing structure for an independently packaged radio frequency power amplifier chip. Background technique [0002] The installation structure of the traditional independently packaged RF power amplifier chip (hereinafter referred to as the power amplifier chip or chip) is as follows: figure 1 , figure 2 shown. The printed board is slotted, the chip passes through the slot, the chip pins are welded to the pads of the printed board, and the printed board is fixed on the cavity board by screws. The back of the power amplifier chip is the ground terminal, which needs to be in good contact with the cavity. The flange type power amplifier chip is usually fixed on the cavity plate by screws; the non-flange type power amplifier chip is usually welded or bonded to the cavity plate. [0003] The RF power amplifier chip is the core device in the high-power amplifier. Acco...

AI Technical Summary

Problems solved by technology

This will lead to poor grounding at the center of the bottom of the chip, which will easily generate parasitic resistance, capacitance, and reactance, which will affect the performance of the chip

At the same time, poor contact causes the contact thermal resistance between the chip and the cavity to increase, which affects the heat dissipation of the chip and further affects the performance of the chip

In addition, because only the flanges on both sides of the chip are fixed, in the shock vibration test, the vibration amplitude at the middle position is relatively large, which may easily lead to cracking of the chip pins and the printed board, or even breakage of the lead chip pins, resulting in failure of the power amplifier module

[0006] For the non-flange power amplifier chip, it is fixed by welding or bonding, the chip assembly process is complicated, and it is inconvenient to disassemble and assemble, and the maintainability is low

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