A kind of ultrasonic wire bonding ultrasonic frequency self-adjustment method

Abstract

The invention provides an ultrasonic lead bonding ultrasonic frequency self-adjusting method. The ultrasonic lead bonding ultrasonic frequency self-adjusting method includes the following steps: 1) acquiring electric signals of an ultrasonic generator through a measurement circuit; 2) sending the electric signals, of the ultrasonic generator, acquired in the step 1) to a signal analysis and processing module, processing the electric signals through fast Fourier transform FFT, and calculating the inherent frequency of the bonding tool; and 3) automatically extracting the inherent frequency andsending the inherent frequency to a control system by the signal analysis and processing module, automatically detecting the loading frequency of the ultrasonic generator by the control system, at thesame time receiving the inherent frequency from the signal analysis and processing module, comparing the ultrasonic generator frequency with the inherent frequency, and adjusting and controlling thefrequency of the ultrasonic generator (1) to enable the frequency of the ultrasonic generator (1) to be equal to the inherent frequency. The ultrasonic lead bonding ultrasonic frequency self-adjustingmethod has the advantages of realizing automatic adjustment of the ultrasonic frequency during the bonding process, being able to effectively improve the bonding success rate through system design, and being suitable for promotion and application.

Description

technical field [0001] The invention relates to an ultrasonic frequency self-adjustment method for ultrasonic wire bonding, which belongs to the technical field of automatic control. Background technique [0002] Ultrasonic wire bonding is one of the most important technologies in IC chip interconnection. Provides the interconnection of pins between the chip and the substrate. It refers to the ultrasonic vibration generated by the piezoelectric transducer and the pressure of the bonding tool to bond the wire (gold wire or aluminum wire) to the pad at the bottom of the chip (attached) at room temperature. figure 1 ), so as to connect the chip and the circuit of the substrate together. The quality of the bonding point will directly affect the performance of the IC chip, and a small bonding point failure may cause the failure of the entire IC chip. [0003] For example, the application number CN204425191U discloses a chip external lead bonding ultrasonic power supply control...

AI Technical Summary

Problems solved by technology

In the bonding process, the ultrasonic frequency is generally the natural frequency of the bonding tool. For a general bonding system, its frequency value is about 63.5kHz. The natural frequency often deviates from the ultrasonic frequency, which fails to achieve the purpose of loading with the natural frequency. The invention discloses an automatic monitoring and adjustment device for the natural frequency of a bonding tool, which can realize automatic adjustment of the ultrasonic frequency during the bonding process.

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