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Method for improving coordinate precision of photoetching machine

A technology of lithography machine and coordinates, which is applied in the application field of mask plate technology, can solve the problems of mask plate deformation, deformation, mask plate XY result difference, etc., and achieve the effect of improving position accuracy

Active Publication Date: 2018-05-25
深圳清溢光电股份有限公司
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Problems solved by technology

However, since the plate is placed on the lithography machine, it will be deformed due to gravity. The dirt on the machine platform, the particles attached to the back of the mask, or the air bubbles between the mask and the platform will cause the mask to deform, resulting in different periods of time. The XY results of measuring the mask are poor, and if the deformation is too large, there may even be micron-level errors

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  • Method for improving coordinate precision of photoetching machine

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Embodiment 1

[0014] A method for improving the coordinate accuracy of a lithography machine, the method for improving the coordinate accuracy of a lithography machine, step 1, surveying and mapping the height map of the upper surface of the mask plate; step 2, using the height map in step 1 to calculate the compensation position map; step 3 , to calibrate the position coordinates of the lithography machine platform; among them, the first step is to measure the height using the optical focusing Auto Focus system of the lithography machine. This system detects the surface position of the mask plate through a 4-phase Photo diode, and then drives it through a Piezo The lens moves up and down to keep the distance between the lens and the reticle fixed. After eliminating the hysteresis effect of Piezo, the surface height of the mask can be calculated from the position of Piezo, and the compensation calculation in step 2 is based on the neutral layer principle.

[0015] The principle of the neutr...

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Abstract

The invention discloses a method for improving coordinate precision of a photoetching machine. The method includes steps: step one, surveying and mapping a height map of the upper surface of a mask plate; step two, calculating a compensation position map, wherein compensation calculation is carried out based on a neutral layer principle; step three, subjecting a photoetching machine platform to position coordinate calibration. The method guarantees uniformity of measurement results of the same mask plate measured in different time.

Description

technical field [0001] The invention relates to the application of mask plate technology. Background technique [0002] Before the lithography machine draws the mask, its XY platform coordinate system must be accurately calibrated. However, since the plate is placed on the lithography machine, it will be deformed due to gravity. The dirt on the machine platform, the particles attached to the back of the mask, or the air bubbles between the mask and the platform will cause the mask to deform, resulting in different periods of time. The XY results of measuring the mask are poor, and if the deformation is too large, there may even be micron-level errors. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a method for improving the coordinate accuracy of a photolithography machine. [0004] In order to solve the above technical problems, specifically, the technical solution of the present invention is as follows: [...

Claims

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Application Information

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IPC IPC(8): G03F7/20
CPCG03F7/70775G03F7/70783G03F7/7085
Inventor 李跃松莫卫东朱春晖洪志华
Owner 深圳清溢光电股份有限公司
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