Vacuum defoaming device and method for epoxy resin cured at room temperature

An epoxy resin, room temperature curing technology, applied in the direction of foam dispersion/prevention, can solve the problem of no cooling measures, etc., achieve the effect of improving pouring quality, prolonging curing time, and meeting the needs of vacuum degassing

Active Publication Date: 2018-06-01
WUHAN MARINE ELECTRIC PROPULSION RES INST CHINA SHIPBUILDING IND CORP NO 712 INST
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Problems solved by technology

[0004] These two defoaming methods can complete the defoaming work of liquid epoxy resin, but there are areas where the epoxy resin film is enriched, and there are no effective cooling measures, such as using these two devices to cure epoxy resin at room temperature Vacuum defoaming, the resin will heat up and solidify quickly

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  • Vacuum defoaming device and method for epoxy resin cured at room temperature

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0021] like figure 1 As shown, a room temperature curing epoxy resin vacuum pouring device includes a degassing tank, the degassing tank main body 1 and the degassing tank hatch 5 are sealed by an O-shaped sealing ring 9, and the degassing tank hatch 5 is provided with Quartz glass observation window 6, the top of the degassing tank main body 1 is provided with a feed port 14 and an air extraction port 4, and the bottom of the degassing tank main body 1 is provided with a current collector and a discharge port 7; it also includes a cooling device, which is composed of internal cooling fins 11. The wall of the defoaming tank and the outer cooling fins 8 are composed. The inner cooling fins 11 are composed of seven umbrella-shaped heat-conducting fins distributed along the axial direction of the main axis of the defoaming tank. The spacing of the...

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Abstract

The invention discloses a vacuum defoaming device for epoxy resin cured at room temperature. The vacuum defoaming device comprises a defoaming tank, a stirring device and a cooling device, wherein thedefoaming tank comprises a main defoaming tank body and a defoaming tank cabin door, and a quartz glass observation window is arranged on the defoaming tank cabin door; the stirring device comprisesstirring paddles, a magnetofluid rotating seal part and a drive motor; the cooling device comprises internal radiating fins and external radiating fins, and the internal radiating fins comprise multiple umbrella-shaped heat conducting fins distributed in the axial direction of a spindle of the main defoaming tank body. The invention further discloses a vacuum defoaming method for the epoxy resin cured at the room temperature. According to the defoaming device and the defoaming method, the problems of stirring foaming and umbrella cover structure based foaming in the prior art are solved very well, gas in the epoxy resin can be effectively removed, meanwhile, heat produced through resin reaction is guided out of the defoaming tank efficiently, resin curing time is prolonged, coil pouring quality is improved, and the requirement for vacuum defoaming of the epoxy resin cured at the room temperature is met accordingly.

Description

technical field [0001] The invention belongs to the epoxy resin vacuum defoaming technology, in particular to a vacuum defoaming device and a defoaming method for curing epoxy resin at room temperature with short curing time and large consumption. Background technique [0002] In the field of superconducting applications, low-temperature epoxy resin is used as a filling material for superconducting coils to improve the mechanical strength and insulation properties of superconducting coils. In order to reduce the thermal stress generated by the coil during the cooling process, room temperature curing epoxy resin is usually selected. After the curing agent is added to this type of resin, an exothermic reaction begins to occur. If no measures are taken, the resin will become viscous or even solidified during the defoaming process, so the vacuum casting of epoxy resin cannot be completed. [0003] The existing epoxy resin defoaming device mainly has two structural forms, one is...

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Application Information

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IPC IPC(8): B29C39/42B29C39/22B01D19/02B29K63/00
CPCB01D19/02B29C39/22B29C39/42B29K2263/00
Inventor 李位勇钮小军郭祥华陈伟郑军
Owner WUHAN MARINE ELECTRIC PROPULSION RES INST CHINA SHIPBUILDING IND CORP NO 712 INST
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