Heterogeneous rigid-flexible board and multilayer board card manufacture method based on same

A production method and multi-layer board technology are applied in the fields of printed circuit manufacturing, structural connection of printed circuits, printed circuit components, etc., which can solve the problems of low production efficiency, inconformity with individualization, and multiple interfaces with multiple components, etc., to achieve The structure is simple, the production efficiency is improved, and the connection relationship is clear

Pending Publication Date: 2018-06-12
CHENGDU GUORONG TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] On the one hand, the above scheme uses more connectors and higher cost. At the same time, because more connectors lead to more interfaces and more components, the efficiency of assembly, stocking and other production links is low;
[0005] On the other hand, limited by the shape and fixed structure of the inter-board connector, the position between each board is also relatively fixed, which limits the structural design of multi-layer boards in a certain space.
This does not meet the needs of personalized and customized board design

Method used

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  • Heterogeneous rigid-flexible board and multilayer board card manufacture method based on same
  • Heterogeneous rigid-flexible board and multilayer board card manufacture method based on same
  • Heterogeneous rigid-flexible board and multilayer board card manufacture method based on same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Such as Figure 1-Figure 3 As shown, a heterogeneous rigid board includes a rigid printed board, a flexible printed board, and an inter-board connector. The inter-board connector used to control the stacking height between two adjacent rigid printed boards is welded on the rigid printed board. At one end of the board, the adjacent rigid printed boards communicate with each other through the inter-board connector. One end of the flexible printed board is printed and connected to the rigid printed board and the other end is detachably connected to the board. The rigidity of the corresponding connection Printed boards and boards communicate with each other through flexible printed boards.

[0043] In this example, if Figure 4 , Figure 5 As shown, a heterogeneous rigid board unit includes a rigid printed board, a flexible printed board, and an inter-board connector. The rigid printed board and the flexible printed board are printed integrally, and the inter-board connec...

Embodiment 2

[0047] A heterogeneous rigid board, including a rigid printed board, a flexible printed board, and an inter-board connector, the inter-board connector used to control the stacking height between two adjacent rigid printed boards is welded at one end of the rigid printed board , signals are communicated between adjacent rigid printed boards through board-to-board connectors, one end of the flexible printed board is printed and connected to the rigid printed board and the other end is detachably connected to the card, and the correspondingly connected rigid printed board , Boards communicate with each other through flexible printed boards.

[0048] In this example, if Image 6 , Figure 7As shown, a heterogeneous rigid board unit includes a rigid printed board, two flexible printed boards, an inter-board connector, a rigid printed board and a flexible printed board on both sides of the rigid printed board / bottom Made of integrated printing, the inter-board connector is welded ...

Embodiment 3

[0051] This embodiment is optimized on the basis of Embodiment 1 or 2. The end of the flexible printed board connected to the board is provided with half-star and half holes for welding and fixing pin pins of the board. The star-moon half-hole is a metallized star-moon half-hole.

[0052] The use of star-moon half-holes can increase the tension of the copper skin on the bottom layer of the surface, prevent the copper skin from falling off, and increase the connection of the bottom layer of the surface.

[0053] Other parts of this embodiment are the same as those of Embodiment 1 or 2 above, so details are not repeated here.

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PUM

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Abstract

The invention discloses a heterogeneous rigid-flexible board. The heterogeneous rigid-flexible board comprises rigid printed boards, flexible printed boards and inter-board connectors. The inter-boardconnectors for controlling the stacking height between every two adjacent rigid printed boards are welded to one ends of the rigid printed boards. The adjacent rigid printed boards are in signal communication through the inter-board connectors. One ends of the flexible printed boards are connected to the rigid printed boards, and the other ends of the flexible printed boards are connected to board cards detachably. The rigid printed boards and the board cards, which are connected correspondingly, are in signal communication through the flexible printed boards. The heterogeneous rigid-flexibleboard has the advantages that personalized and customized design demands can be met, limited workpieces can be fully utilized for optimal design, and the heterogeneous rigid-flexible board is simplein structure and has high market competiveness. The invention further discloses a multilayer board card manufacture method based on the heterogeneous rigid-flexible board. The multilayer board card manufacture method has the advantages of simple process and high working efficiency.

Description

technical field [0001] The invention relates to the field of electronic devices, in particular to a heterogeneous rigid board and a method for manufacturing a multilayer board based on the heterogeneous rigid board. Background technique [0002] Today, with the rapid development of communication electronic technology, people have higher and higher requirements for the integration and flexibility of communication electronic equipment. In the traditional design scheme, dedicated processing slots and interface slots are usually used for each business requirement, and inter-board signal intercommunication and integration are performed through the system backplane, inter-board connectors or cables. In order to realize the expansion of the printed circuit board (PrintedCircuitBoard, PCB) card function, there are the following solutions: Figure 8 As shown, the printed circuit board includes: a connector 101 , an adapter board 102 , a single board 103 , a system backplane 104 , and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/36
CPCH05K1/148H05K3/361
Inventor 吴明峰
Owner CHENGDU GUORONG TECH
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