Four-axis excitation device for performing out-of-chip excitation on MEMS microstructure

Abstract

The invention discloses a four-axis excitation device capable of dynamically driving an MEMS microstructure. The excitation device comprises a sleeve, a bottom plate, a piezoelectric ceramic, a pressure sensor, an upper connecting block, a lower connecting block, a steel ball, an elastic supporting part and the MEMS microstructure; an annular top plate is arranged at the upper end of the sleeve, the microstructure is arranged on the annular top plate through the elastic supporting part; guide shafts are uniformly distributed between the top plate and the bottom plate, the lower connecting block is uniformly provided with guide support arms which penetrate through the sleeve wall and sleeve the guide shafts; the upper connecting block and the lower connecting block are respectively providedwith a conical groove and a spherical groove which are matched with each other, tension springs are uniformly distributed between the upper connecting block and the lower connecting block to make thesteel ball be clamped between the conical groove and the spherical groove; and the piezoelectric ceramic is clamped between the pressure sensor and the elastic supporting part. According to the device, pre-tightening force of different sizes can be applied to the piezoelectric ceramics, meanwhile, the obtained pre-tightening force measurement value is more accurate, so that the adjustment processof the parallelism error of the two working surfaces of the compensation piezoelectric ceramic can be smoother, and dynamic characteristic parameters can be tested conveniently.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronic systems, and in particular relates to a four-axis vibration excitation device capable of exciting MEMS microstructures off-chip. Background technique [0002] Due to the advantages of low cost, small size and light weight, MEMS microdevices have broad application prospects in many fields such as automobile, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. For many MEMS devices, the micro-displacement and micro-deformation of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of dynamic characteristic parameters such as the amplitude, natural frequency, and damping ratio of these microstructures has become the key to developing MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructure, it is fir...

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Problems solved by technology

[0006] 2. There is no direct connection between the upper connection block and the lower connection block and the sleeve, but are installed in the sleeve in turn by means of clearance fit. If the parallelism error of the two working surfaces of the stacked piezoelectric ceramics is large , there is not enough space to adjust the movable base structure;

[0007] 3. The pressure sensor is installed at the bottom of the lower connecting block. Since the movable base structure adjusts itself, there is a certain inclination between the bottom of the lower connecting block and the working surface of the piezoelectric ceramic, so the pre-tightening force measured by the pressure sensor Or the output force of piezoelectric ceramics is not accurate; in addition, if the movable base structure causes the upper coupling block or the lower coupling block to contact the sleeve after adjustment, the error of the measurement result will further increase;

[0009] 5. In this device, gaskets of different thicknesses are used to change the magnitude of the pre-tightening force applied to the stacked piezoelectric ceramics, which makes the adjustment process complicated and not flexible enough

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