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Fabrication method of flashmemory floating grid and NOR flashmemory

A fabrication method and floating gate technology, which are applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problem of increasing the difficulty of filling the floating gate layer, etc.

Inactive Publication Date: 2018-06-15
WUHAN XINXIN SEMICON MFG CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The object of the present invention is to provide a method for manufacturing floating gates of flash memory and NOR flash memory, so as to solve the problem of increasing difficulty in filling the floating gate layer as the process node decreases in the existing floating gate manufacturing process of flash memory

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  • Fabrication method of flashmemory floating grid and NOR flashmemory
  • Fabrication method of flashmemory floating grid and NOR flashmemory
  • Fabrication method of flashmemory floating grid and NOR flashmemory

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Embodiment Construction

[0024] Fabrication of the floating gate is critical to the performance of flash memory. For a flash memory with a stacked gate structure of a control gate and a floating gate, the control gate controls the storage or release of electrons in the floating gate through coupling with the floating gate, thereby increasing the coupling rate between the control gate and the floating gate and improving the same The uniformity of coupling ratio between different flash memory cells on the substrate is one of the key considerations in the flash memory manufacturing process.

[0025] Figure 1a to Figure 1d It is a schematic cross-sectional view of a manufacturing method of a floating gate of a NOR flash memory. It can be used, for example, in the manufacture of floating gates of 65nm NOR flash memory, and specifically includes the following steps.

[0026] First, if Figure 1a As shown, a pad oxide layer 101 and a silicon nitride layer 102 are formed on a semiconductor substrate 100 . ...

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Abstract

The invention relates to a fabrication method of a flashmemory floating grid and an NOR flashmemory. A tunneling oxide layer, a floating grid layer and a hard mask layer are sequentially laminated andformed on a semiconductor substrate, the hard mask layer, the floating grid layer, the tunneling oxide layer and the semiconductor substrate are etched, a plurality of isolation grooves are formed inthe semiconductor substrate, groove oxide layers are formed on inner walls of the grooves, isolation mediums are filled so that the isolation mediums are flush with an upper surface of the hard masklayer, the isolation mediums are etched to form isolation structures, and the hard mask layer is finally removed to form floating grids among the isolation structures. Compared with a method of filling the gaps among the isolation mediums with the floating gird layer in the prior art, the fabrication method has the advantages that the problem that the filling difficulty of the floating grid layeris improved with the increase of depth-to-width ratio of the gaps; and the hard mask layer covers the floating grid layer, a chemical mechanical polishing (CMP) process is prevented from being directly acted on the floating grid layers, and the influence of the isolation medium etching process on the tunneling oxide layer is relatively small.

Description

technical field [0001] The invention relates to the field of semiconductor technology, in particular to a manufacturing method of a flash memory floating gate and a NOR flash memory. Background technique [0002] With the development of semiconductor technology, flash memory (flash memory) has been widely used as a non-volatile memory. The flash memory adds a floating gate and a tunnel oxide layer on the basis of the traditional MOS transistor structure, and uses the floating gate to store charges, thereby realizing non-volatile storage content. [0003] NAND flash memory and NOR flash memory are two important non-volatile flash memory technologies in the market today. Among them, NOR flash memory can perform independent read and write operations on each storage unit, providing a complete random access function, so it can be used for non-volatile storage of executable programs, while NAND flash memory cannot provide complete random access The fetch function is used to inde...

Claims

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Application Information

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IPC IPC(8): H01L21/28H01L27/11521
CPCH01L21/28008H10B41/30
Inventor 曹开玮
Owner WUHAN XINXIN SEMICON MFG CO LTD