No hysteresis effect silicon controlled rectifier type esd protection structure and its realization method

A technology of ESD protection and silicon-controlled rectifiers, which is applied in semiconductor devices, electric solid-state devices, semiconductor/solid-state device manufacturing, etc., can solve the problems of small secondary breakdown current, large device size, large layout area, etc., and achieve reduction width, the effect of reducing device size

Active Publication Date: 2019-10-25
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Application Information

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Problems solved by technology

The low-voltage PMOS device is a common electrostatic protection device without hysteresis effect, because the parasitic PNP transistor current gain is relatively small when the hysteresis effect occurs, but the shortcoming of the low-voltage PMOS device is the secondary breakdown of the hysteresis effect The current (It2) is relatively small, so the industry has been researching and developing an anti-static protection device that has no hysteresis effect and has a high secondary breakdown current.
However, the disadvantage of the existing silicon-controlled rectifier without hysteresis effect is that the device size is relatively large, especially when several stages are required to be connected in series, the layout area is relatively large

Method used

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  • No hysteresis effect silicon controlled rectifier type esd protection structure and its realization method
  • No hysteresis effect silicon controlled rectifier type esd protection structure and its realization method
  • No hysteresis effect silicon controlled rectifier type esd protection structure and its realization method

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Embodiment Construction

[0031] The implementation of the present invention is described below through specific examples and in conjunction with the accompanying drawings, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0032] Figure 4 It is a circuit structure diagram of a preferred embodiment of a silicon-controlled rectifier type ESD protection structure without hysteresis effect in the present invention. like Figure 4 As shown, the present invention discloses a silicon-controlled rectifier type ESD protection structure without hysteresis effect, including a plurality of shallow trench isolation laye...

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Abstract

The invention discloses a no-Snapback silicon controlled rectifier type ESD protection structure and a realization method thereof. The structure comprises: a semiconductor substrate (80); and an N-well (60) and a P-well (70) that are generated on the semiconductor substrate. A high-concentration P-doped layer (20) and a high-concentration N-doped layer (28) are arranged above the N-well (60). Thehigh-concentration P-doped layer (20), the N-well (60) and the P-well (70) form an equivalent PNP triode structure. A high-concentration N-doped layer (24) and a high-concentration P-doped layer (26)are arranged above the P-well (70). The N-well (60), the substrate (80) / the P-well (70) and the high-concentration N-doped layer (24) form an equivalent NPN triode structure. A high-concentration N-doped layer (22) is arranged above a boundary between the N-well (60) and the P-well (70). A portion of the N-well (60) is arranged between the high-concentration P-doped layer (20) and the high-concentration N-doped layer (28), and the distance between the high-concentration P-doped layer (20) and the high-concentration N-doped layer (28) is S. A portion of the N-well (60) is arranged between the high-concentration N-doped layer (28) and the high-concentration N-doped layer (22).

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuits, in particular to a novel silicon-controlled rectifier-type ESD protection structure without hysteresis effect and a realization method thereof. Background technique [0002] The anti-static protection design of high-voltage circuits has always been a technical problem, because the core of high-voltage circuits: high-voltage devices (such as LDMOS) are not suitable for anti-static protection design like ordinary low-voltage devices, because the hysteresis effect curve of high-voltage devices The exhibited characteristics are poor. like figure 1 as shown, figure 1 It is the hysteresis effect curve of a high-voltage device LDMOS with a working voltage of 32V, from figure 1 It can be concluded that: 1) the trigger voltage (Vt1) is too high; 2) the holding voltage (Vh) is too low, often far lower than the operating voltage of the high-voltage circuit, and it is easy to cau...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/02H01L21/82
CPCH01L21/82H01L27/0262
Inventor 朱天志
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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