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LED packaging technology and LED packaging system

A technology of LED packaging and packaging technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems that affect product reliability, reduce packaging brightness, and generate bubbles, so as to ensure quality and pass efficiency, improve LED service life, and improve The effect of service life

Active Publication Date: 2018-06-19
浙江鹏隆科技有限公司
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

In this process, there may be improper welding wire parameters, which may lead to dead light caused by falling off between the gold ball and the electrode, making the LED invalid, and using silver glue to fix the crystal will absorb a small amount of light energy, which will reduce the brightness of the package. Due to the thin packaging material , easy to produce bubbles, cracks and affect product reliability

Method used

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  • LED packaging technology and LED packaging system
  • LED packaging technology and LED packaging system
  • LED packaging technology and LED packaging system

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Embodiment Construction

[0029] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0030] A process and system for packaging LEDs, comprising the following steps: S1: Apply silver glue on a bracket by dispensing equipment, and then bond chips to the silver glue to obtain LEDs; S2: Fix the LEDs with a crystal-bonding mechanism Crystallization operation, the specific principle is the existing technology, so it will not be repeated; then use a dryer to bake the LED at a temperature of 150°C for 2 hours; S3: Mold the LED for the first time with molding equipment, molding operation and principle It is an existing technology, so it will not be described in detail; S4: use fluorescent coating equipment to coat fluorescent film on LED, and the specific coating princ...

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Abstract

The present invention discloses an LED packaging technology and an LED packaging system. The LED packaging technology comprises the following steps of firstly adhering a chip and an FPC with a silvercolloid, then using a die bonder to die bonding an LED, using a mold pressing device to carry out the first time mold pressing on the LED, and secondly using a fluorescent coating device to coat a fluorescent film on the LED, using the mold pressing device to carry out the second time mold pressing on the LED, and finally using a packaging machine to package the LED, and warehousing the packaged LED. The LED packaging technology and LED packaging system of the present invention break through a conventional packaging technology, adopt a flip chip bonding mode to conduct electricity, do not needthe gold wires to connect, reduce the LED failure due to the bonding wire problems, and are better in radiating effect.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, and in particular relates to a novel LED packaging process and system thereof. Background technique [0002] At present, most of the LEDs on the market adopt the traditional packaging form, the wire bonding type, that is, the chip and the bracket are connected with gold wires. In this process, there may be improper welding wire parameters, which may lead to dead light caused by falling off between the gold ball and the electrode, making the LED invalid, and using silver glue to fix the crystal will absorb a small amount of light energy, which will reduce the brightness of the package. Due to the thin packaging material , easy to produce bubbles, cracks and affect product reliability. Contents of the invention [0003] In view of the above problems, the present invention provides an LED packaging process and a system thereof which have a long service life and effectively improve the LED h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/64H01L33/50
CPCH01L33/505H01L33/62H01L33/64H01L33/641H01L2933/0033
Inventor 郭经洲程一龙王晓哲李辉
Owner 浙江鹏隆科技有限公司
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