Polishing pad trimmer and polishing system

Abstract

The invention relates to a polishing pad trimmer and a polishing system. The polishing pad trimmer comprises a trimming arm and a rotating speed control component, the trimming arm comprises a plurality of rollers connected end to end, and the total length of the multiple rollers is larger than or equal to the radius of a polishing pad; and the rotating speed control component is connected with the multiple rollers and controls the rotating speed of each roller, and the rotating speed of the roller close to the center of the polishing pad is larger than the rotating speed of the roller close to the edge of the polishing pad. According to the scheme, the coincidence of the center zone height and the edge zone height of the polishing pad can be improved, and the surface topography is optimized.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing equipment, in particular to a dresser for a polishing pad and a polishing system. Background technique [0002] In the semiconductor manufacturing process, chemical mechanical polishing (CMP) is widely used as an effective processing method to obtain a planar layer without surface damage, such as for forming an inter-level dielectric layer (Inter-level Dielectric, ILD ) and damascene metallization (Damascene Metallization) process. [0003] During the polishing process, it is often necessary to hold the wafer against a rotating polishing pad and introduce a slurry to the polishing pad, which contains chemicals that can break down the material on the wafer surface and physically attack the wafer surface. Abrasive particles on a round surface. Wafers are polished by the continuous application of chemical and mechanical forces to the wafer surface. [0004] Due to the accumulation of deb...

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Problems solved by technology

[0004] Due to the accumulation of debris from the abrasive slurry and the continuous friction of the wafer surface, the surface of the polishing pad will become smooth or hardened, resulting in a decrease in the polishing effect. Therefore, it is necessary to use a dresser to dress the polishing pad to increase the roughness of the surface of the polishing pad.

[0005] In the existing polishing pad dresser, the surface of the polishing pad is moved on the surface of the polishing pad by adopting a dressing disk in contact with the surface of the polishing pad, but the dresser of the prior art will cause the central area of ​​the polishing pad to be higher than the surface of the polishing pad after dressing. In the edge area, the uniformity of the surface topography is poor

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