MEMS (Micro-electromechanical System) microstructure triaxial exciting device with piezoelectric ceramic as exciting source

Abstract

The invention discloses an MEMS (Micro-electromechanical System) microstructure triaxial exciting device with piezoelectric ceramic as an exciting source. The MEMS microstructure triaxial exciting device comprises a sleeve, the piezoelectric ceramic, a pressure sensor, an upper connecting block, a lower connecting block, elastic supporting members and an MEMS microstructure, wherein an annular topplate and a base plate are respectively arranged at two ends of the sleeve; the microstructure is arranged on the annular top plate by the elastic supporting member; guiding shafts are uniformly distributed between the annular top plate and the base plate; guiding support arms are uniformly distributed on the edge of the lower connecting block, respectively penetrate through the wall of the sleeve and sleeve the corresponding guiding shafts; locking devices are respectively arranged on the guiding support arms; a conical groove and a bump which are matched with each other are respectively formed in the upper connecting block and the lower connecting block; the piezoelectric ceramic is clamped between the pressure sensor and the elastic supporting members; and the outer edge of the upper connecting block is positioned in the sleeve by a ball head plunger. The device has the advantages that pretightening forces with different strengths can be applied to the piezoelectric ceramic, the obtained pretightening force measurement value is more accurate, the adjusting process of compensating parallelism error between two working faces of the piezoelectric ceramic is enabled to smoother, and dynamic characteristic parameters are favorably tested.

Description

technical field [0001] The invention belongs to the technical field of micromechanical electronic systems, and in particular relates to a MEMS microstructure three-axis vibration device using piezoelectric ceramics as an excitation source. Background technique [0002] Due to the advantages of low cost, small size and light weight, MEMS microdevices have broad application prospects in many fields such as automobile, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. For many MEMS devices, the micro-displacement and micro-deformation of their internal microstructures are the basis for the realization of device functions. Therefore, accurate testing of dynamic characteristic parameters such as the amplitude, natural frequency, and damping ratio of these microstructures has become the key to developing MEMS products. important content. [0003] In order to test the dynamic characteristic parameters of the microstructu...

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Problems solved by technology

[0006] 2. There is no direct connection between the upper connection block and the lower connection block and the sleeve, but are installed in the sleeve in turn by means of clearance fit. If the parallelism error of the two working surfaces of the stacked piezoelectric ceramics is large , there is not enough space to adjust the movable base structure;

[0007] 3. The pressure sensor is installed at the bottom of the lower connecting block. Since the movable base structure adjusts itself, there is a certain inclination between the bottom of the lower connecting block and the working surface of the piezoelectric ceramic, so the pre-tightening force measured by the pressure sensor Or the output force of piezoelectric ceramics is not accurate; in addition, if the movable base structure causes the upper coupling block or the lower coupling block to contact the sleeve after adjustment, the error of the measurement result will further increase;

[0009] 5. In this device, gaskets of different thicknesses are used to change the magnitude of the pre-tightening force applied to the stacked piezoelectric ceramics, which makes the adjustment process complicated and not flexible enough

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