Semiconductor device and formation method thereof
A semiconductor and device technology, applied in the field of semiconductor devices and their formation, can solve problems such as complex semiconductor device processes, and achieve the effects of simplifying the process and avoiding tunneling leakage.
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[0027] As mentioned in the background, the process of forming semiconductor devices in the prior art is relatively complicated.
[0028] A method for forming a semiconductor device, comprising: providing a semiconductor substrate, the semiconductor substrate includes a core region and an edge region, the semiconductor substrate in the core region has a first gate structure, and the semiconductor substrate in the edge region There is a second gate structure on the bottom; a first source-drain doped layer is formed in the semiconductor substrate in the core area on both sides of the first gate structure; a second source is formed in the semiconductor substrate in the edge area on both sides of the second gate structure. Drain doped layer.
[0029] In order to avoid tunneling leakage between the source-drain doped layer in the edge region and the semiconductor substrate in the edge region, the ion concentration in the second source-drain doped layer is required to be lower than t...
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