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A method for solving the thickness distribution of abrasive grains and its application in grinding process design

A technology of grinding dosage and abrasive grains, applied in the field of grinding, can solve problems such as difficulty in optimization and difficulty in achieving results

Active Publication Date: 2020-05-05
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] On the other hand, the optimization of the traditional grinding process is carried out according to the given grinding wheel, which is very difficult to optimize the grinding process, and it is difficult to achieve the desired effect

Method used

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  • A method for solving the thickness distribution of abrasive grains and its application in grinding process design
  • A method for solving the thickness distribution of abrasive grains and its application in grinding process design
  • A method for solving the thickness distribution of abrasive grains and its application in grinding process design

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Embodiment 1

[0052] The method for solving the thickness distribution of abrasive grains is described in detail below in conjunction with the accompanying drawings:

[0053] Grinding wheel parameters are adopted: grinding wheel diameter ds=300cm, width 10cm, abrasive particle parameters are expressed by distribution function, particle size, position and edge height are all normal distribution, distribution parameters are: particle size N(550,0.25), position N(0.1 ,0.4) and edge height N(67,0.15), the grinding amount is: grinding speed vs=78m / s, feed speed vw=15m / min, grinding depth is 8um.

[0054] Step A. Construct a digital grinding wheel: express the abrasive grain parameters on the surface of the grinding wheel as a matrix {G jk} p×q , p×q means that the matrix {Φ} is a matrix with p rows and q columns, that is, the outer circle of the grinding wheel has p rows and q columns of abrasive particle distribution, in this embodiment p=9000, q=20; element G jk Indicates the abrasive grains...

Embodiment 2

[0072] This embodiment explains in detail the specific implementation method of the application method of a method for solving the thickness distribution of abrasive grains in the design of the grinding process:

[0073] In this embodiment, the grinding tool is a grinding wheel, and the grinding process is designed with the goal of obtaining a good machined surface quality. The workpiece is No. 45 steel, and the surface roughness Ra of the processing result is expected to be less than 0.4um. The user has given a grinding wheel with a diameter of 400mm and a width of 15m. The estimated grinding consumption is: grinding speed vs=100m / s, feed speed vw=10m / min, grinding depth is 5um. The set standard value is that the error of the cut thickness distribution of the two abrasive grains is less than 10%.

[0074] Step 1: Set the target abrasive grain cutting thickness distribution according to the processing results, such as Figure 5 Shown in distribution A.

[0075] Step 2: Acc...

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Abstract

The invention discloses an application method of abrasive particle cutting thickness distribution solution in grinding process design. A solution method comprises the steps that A, a digitized grinding wheel is established; B, an abrasive particle track outline is calculated; C, a workpiece is dispersed; and D, abrasive particle cutting thickness distribution is calculated. The application methodof the method applied to the grinding process design specially comprises the steps that the target abrasive particle cutting thickness distribution is set according to a machining result; next, optimal grinding wheel abrasive particle parameters are obtained according to the target cutting thickness distribution constraint; then, by means of the optimal grinding wheel abrasive particle parameters,an actual grinding wheel is prepared and measured, and abrasive particle parameters of the actual grinding wheel are obtained; and finally, the actual grinding wheel abrasive particle parameters areinput and combined with a machining result, and grinding amount optimization is carried out. Grinding machining is carried out by matching the actual grinding wheel manufactured through the optimal parameters and the optimal grinding amount, and an expected machining result can be efficiently achieved with high quality and low cost.

Description

technical field [0001] The invention relates to the field of grinding. Background technique [0002] Grinding is the main processing method for parts with high dimensional accuracy and high surface quality, and is an important part of advanced manufacturing technology. The control of the grinding process and the accurate prediction of the machining results are very important to the high-efficiency precision grinding technology. Grinding is a processing method in which many abrasive grains are controlled by a bond to achieve micro-cutting, and then macroscopically remove the workpiece material. In other words, grinding is the removal of material on the tool at the macro level, and at the micro level it is actually the cutting of each abrasive grain. Therefore, the cut thickness value of each abrasive grain has always been a key control quantity of the grinding process and grinding results. [0003] At present, the industry mainly uses the maximum undeformed chip thickness ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/00
CPCB24B1/00
Inventor 徐西鹏黄国钦方从富崔长彩黄辉张玉周
Owner HUAQIAO UNIVERSITY
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