bearing abutment

Abstract

The invention provides a carrying base table, which is used for carrying a glass base plate in a sputtering process. The carrying base table is characterized in that the carrying base table comprisesa base table body and a cooling device arranged on the base table body, wherein the cooling device comprises a heat radiation assembly and a moving mechanism; the heat radiation assembly is used for realizing the accelerated temperature lowering on partial region of the glass base plate after the metal film layer formation on the surface; the moving mechanism is connected with the heat radiation assembly and is used for moving the heat radiation assembly so as to move the heat radiation assembly to be attached to the surface of the glass base plate at the proper time. Compared with the prior art, the carrying base table for carrying the glass base plate in the sputtering process provided by the invention has the beneficial effects that the cooling device is arranged on the surface of the carrying base plate; after a metal film is sputtered and plated on the surface of the glass base plate, the cooling device timely lowers the temperature on easy-to-tilt part of the glass base plate soas to reduce the glass base plate tilting degree.

Description

technical field [0001] The invention relates to the technical field of display production, in particular to a carrying base for carrying a glass substrate in a sputtering process. Background technique [0002] As a key device, thin film transistors directly affect the performance of thin film transistor liquid crystal displays; in the existing TFT-LCD (thin film transistor-liquid crystal display panel) manufacturing field, the preparation of thin film transistors is usually completed by means of magnetron sputtering coating. The phenomenon that energetic particles (such as argon ions) bombard the solid surface and cause various particles (such as atoms, molecules or molecular clusters) on the solid surface to escape from the solid surface is called "sputtering". In the magnetron sputtering coating process, the positive ions generated by argon ionization are usually used to bombard the solid (target), and the sputtered neutral atoms are deposited on the substrate (substrate) ...

AI Technical Summary

Problems solved by technology

Since the thermal expansion characteristics of copper and TFT glass substrates are quite different, the thermal expansion coefficient of copper is 1.62E-5, while the thermal expansion coefficient of glass is 3.75E-6. Therefore, after the sputtering is completed, the thick copper film is cooled from a high temperature of 200° to room temperature. , the TFT glass substrate may be greatly warped, which will affect the quality of the film

[0004] To sum up, when the existing sputtering equipment sputters the copper film on the surface of the glass substrate, due to the difference between the thermal expansion coefficient of the glass substrate and the thermal expansion coefficient of the metal, after the metal film is sputtered on the surface of the glass substrate, the temperature is controlled by the sputtering. After the ambient temperature of 200° is cooled to room temperature, the glass substrate will warp, which will affect the film quality

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