Auxiliary device and method for secondary packaging of CPU

Abstract

The invention relates to an auxiliary device and method for secondary packaging of a CPU, and belongs to the related field of computer equipment. The device mainly comprises a pedestal; a rotary tablewhich is rotatably connected with the pedestal; a Y-axis sliding table which is fixedly connected with the pedestal; an X-axis sliding table driven by the Y-axis sliding table to operate; a blade installed on the Y-axis sliding table; and a Z-axis positioning mechanism located at one side of the rotary table. The Z-axis positioning mechanism is provided with a Z-axis press block, and the Z-axis press block is provided with a groove for accommodating a metal cover. The sum of the width of the X-axis sliding table and the width of the blade is less than the distance between the Z-axis positioning mechanism and the rotary table. The device can cut a part of an adhesive layer through the design of a brand-new structure, and guarantees the accurate positioning of the metal cover and a PCB. Moreover, the device can guarantee that the moving direction of the blade is parallel to the PCB in an adhesive cutting process, and causes no damage to the PCB while the cover of the CPU is opened.

Description

technical field [0001] The present invention relates to related fields of computer equipment, in particular to an auxiliary device and method for secondary packaging of a CPU. Background technique [0002] From the structural analysis of the CPU, it mainly includes three parts: the core, the PCB board and the metal cover. Wherein, the inner core is located at the center of the PCB board, the metal cover is glued to the PCB board, and the central part of the metal cover is close to the inner core. In order to ensure the heat dissipation effect, silicon grease is usually coated on the top surface of the core to avoid air between the top surface of the core and the metal cover when the metal cover is packaged. [0003] Some high-performance CPUs that consume more than 100W also generate a lot of heat. Even if water cooling is installed, the CPU will still exceed 70°C under full load. This will undoubtedly reduce the life expectancy of the CPU to a certain extent, increase th...

AI Technical Summary

Problems solved by technology

[0007] In the actual operation process, it was found that due to the strong adhesive force of the original packaging PCB board and the metal cover, forcibly moving the metal cover will cause the PCB board to move in the same direction, and the extrusion of the PCB board and the body will cause the PCB board to move in the same direction. The board produces deformation that is difficult to detect with the naked eye, causing damage to the internal circuit and scrapping the CPU

[0008] As another case, in the process of manual secondary packaging, it is difficult to ensure the alignment accuracy between the metal cover and the PCB board, and it is difficult to completely clean up the overflowing glue, so that the CPU after packaging cannot be installed on the motherboard.

Images