6PIN dual-interface chip smart card and preparation method thereof

A 6PIN, dual-interface technology, applied in the field of smart cards, to achieve the effects of reduced area, increased design space, and improved reliability

Active Publication Date: 2018-08-03
GIESECKE & DEVRIENT (CHINA) INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Aiming at the problems existing in the preparation of 6PIN dual-interface chip smart cards in the prior art, the invention provides a 6PIN dual-interface chip smart card and a preparation method thereof

Method used

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  • 6PIN dual-interface chip smart card and preparation method thereof
  • 6PIN dual-interface chip smart card and preparation method thereof
  • 6PIN dual-interface chip smart card and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The 6PIN dual interface chip smart card of the present invention includes a 6PIN dual interface chip module, a card body, and a winding antenna. The wire-wound antenna is used to realize the welding connection between the card body and the 6PIN dual interface chip module.

[0032] As an example, the size of the 6PIN dual interface chip module of the 6PIN dual interface chip smart card provided by the present invention is 8.0mm*10.62mm, and the distance between two non-contact contacts is 10.52mm.

[0033] As a better choice, the winding antenna has an M-type winding head (see figure 2 ), and the winding head and tail are lengthened. Specifically, the length of the head (200) and the tail (202) of the winding antenna outside the chip area (204) are both 10mm-11mm. As the distance between the two non-contact contacts of the 6PIN dual interface module is reduced, the existing antenna coil cannot be coupled to communicate with it. When the M-type winding head is used and the wi...

Embodiment 2

[0038] The 6PIN dual interface chip smart card of the present invention includes a 6PIN dual interface chip module, a card body, and a winding antenna. Correspondingly, a method for preparing a 6PIN dual-interface chip smart card includes the following steps:

[0039] 1. Prepare the card base

[0040] See attached figure 1 , The steps of preparing the card base include plate making and ink adjustment steps, and printing and preparing the genuine substrate and the reverse substrate according to the conventional steps, and then enter the next process after passing the inspection.

[0041] 2. Provide intermediate card base material

[0042] Provide the middle substrate layer of the built-in wire-wound antenna, the wire-wound antenna has an M-type wire head; the length of the head and tail of the wire-wound antenna outside the chip area are both 10mm-11mm. The wire-wound antenna is used to realize the welding connection between the card body and the 6PIN dual interface chip module. It s...

Embodiment 3

[0063] A method for preparing a 6PIN dual interface chip includes the following steps:

[0064] 1. Prepare the card base

[0065] See Example 2.

[0066] 2. Provide intermediate card base material

[0067] Provide an intermediate card base material sheet with a built-in wire-wound antenna, the wire-wound antenna having an M-type winding head.

[0068] See figure 2 The M-type winding head of the winding antenna includes windings arranged mirror-symmetrically with a pitch of 0.4mm. For a single winding, it can further include various winding methods, and the specific shape can be It can be adjusted in any desired manner; the length of the head and tail of the M-type winding head outside the chip area is 11 mm.

[0069] 3. Spot welding steps

[0070] Perform spot welding alignment of the middle substrate layer with the wire-wound antenna coil with the original substrate and the reverse substrate, and then perform spot welding alignment on the protective film of the original substrate and t...

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PUM

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Abstract

The invention discloses a 6PIN dual-interface chip smart card and a preparation method thereof. The 6PIN dual-interface chip smart card comprises a 6PIN dual-interface chip module, a card body and a winding antenna, and the winding antenna is used for achieving welding sealing connection between the card body and the 6PIN dual-interface chip module. The 6PIN dual-interface chip smart card is characterized in that the winding antenna has an M-type winding head, and the length of the portion, between the 6PIN dual-interface chip module and the card body, of the head part of the winding antenna is 10-11 mm; the length of the portion, between the 6PIN dual-interface chip module and the card body, of the tail part of the winding antenna is 10-11 mm. According to the provided 6PIN dual-interfacechip smart card, the size of the chip module is 8.0*10.62mm, the area of the chip module is decreased, the cost is reduced, and more convenience is provided for a customer to conduct layout design ofthe card body. According to the provided preparation method for the chip smart card, the problem that the module reliability is reduced due to too high temperature during tinning is solved, and the quality of a prepared product is stable and reliable.

Description

Technical field [0001] The invention belongs to the field of smart cards, and specifically relates to a 6PIN dual-interface chip smart card based on a winding antenna welding process and a preparation method thereof. Background technique [0002] There is a market demand for chip modules in the industry that gradually tends to be miniaturized. It is a trend in the field of smart cards to develop 6PIN dual-interface chip modules in accordance with the market development trend, and to replace traditional smart cards. [0003] The size of the traditional 8PIN dual interface (DI) module is 11.4mm*12.6mm, and its processing technology is a lead-free soldering method. This soldering method has the characteristics of long use time and stable process, but the 8PINDI has a larger area and higher cost. It reduces the usable area of ​​card surface element design for customers. [0004] However, the size of the new 6PIN dual interface module is 8.0mm*10.62mm, and there is a matching problem whe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
CPCG06K19/0772G06K19/07779
Inventor 阮家祺贺瑞粉钟旭峰
Owner GIESECKE & DEVRIENT (CHINA) INFORMATION TECH CO LTD
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