Infrared sensor device

Abstract

Provided is a small-sized infrared sensor device which is capable of measuring temperatures with high accuracy, and wherein a light guide path member has a low heat capacity. An infrared sensor deviceaccording to the present invention is provided with: an infrared sensor main body; and a light guide path member that is arranged so as to surround at least a light receiving surface of the infraredsensor main body and has an opening positioned immediately above the light receiving surface. The light guide path member is formed of a plate material, and at least one surface among the surfaces that surround the light receiving surface is formed as an infrared light reflecting surface that is configured from an inclined plate part wherein the light receiving surface-side surface is inclined toward the opening.

Description

technical field [0001] The present invention relates to an infrared sensor device that detects infrared rays from an object to be measured such as a fixing roller of toner and measures the temperature of the object to be measured. Background technique [0002] Conventionally, an infrared sensor has been used as a temperature sensor that measures the temperature of the object to be measured by non-contact detecting infrared rays radiated from the object to be measured. Such an infrared sensor is used in various fields such as measuring the temperature of a fixing roller of toner (developer) built in copiers, printers, etc., and indoor temperature control of air conditioners. [0003] For example, Patent Document 1 describes a non-contact temperature measurement sensor including an infrared sensor, an optical lens, and a light guide. The light guide for the non-contact temperature sensor is provided on the frame so as to guide infrared rays to the optical lens provided on the...

AI Technical Summary

Problems solved by technology

[0010] That is, in the technique of Patent Document 1, there is a problem that the thickness of the thick-walled light guide is changed to form a tapered light guide path, but the portion of the infrared sensor close to the light guide path becomes thicker and the volume increases, resulting in a The heat capacity of the optical device increases, and the radiation and heat conduction from the light guide path greatly affect the sensitivity and accuracy of the infrared sensor

[0011] In addition, in the technique of Patent Document 2, since the through hole as the light guide path is formed on the substantially rectangular parallelepiped frame, the heat capacity becomes larger along with the large volume of the frame itself as the light guide path member. Radiation and heat conduction greatly affect the sensitivity and accuracy of infrared sensors

[0012] Furthermore, in the technology of Patent Document 3, the guide cylinder for controlling the infrared light reaching the light receiving surface is formed of a thin material, but the guide cylinder has a gradient inclined inward, and has a substantially trapezoidal shape in which the inner diameter of the upper opening side is reduced. In order to guide the desired infrared light to the light-receiving surface in the guide cylinder, the size of the light guide may increase

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