Low-melting-point Sn-Bi-Al series lead-free solder alloy material and preparation method thereof

A lead-free solder alloy and lead-free solder technology are applied in the field of low-melting Sn-Bi-Al series lead-free solder alloy materials and their preparation, which can solve the problems that aluminum and tin-bismuth alloys are not easy to melt each other, and improve the microscopic The effect of hardness

Inactive Publication Date: 2018-08-07
GUANGXI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation method of the present invention can not only refine the structure of the solder, but also make the aluminum particles evenly distributed in the solder alloy, solve the technical problem t

Method used

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  • Low-melting-point Sn-Bi-Al series lead-free solder alloy material and preparation method thereof
  • Low-melting-point Sn-Bi-Al series lead-free solder alloy material and preparation method thereof
  • Low-melting-point Sn-Bi-Al series lead-free solder alloy material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] (1) Weigh 16g of Sn powder and 4g of Bi powder into a ball mill jar.

[0033] (2) Add stainless steel balls, 3 large balls of φ20mm, 60 medium balls of φ10mm, and 90 small balls of φ6mm into the tank where the raw materials have been added; -3 Pa; then fill in an inert gas, and finally put it into a planetary ball mill for ball milling and mixing, the rotating speed is 150rad / min, and the ball milling time is 2 hours.

[0034] (3) Tablet the ball-milled powder, take the uniformly mixed powder and put it into a powder mold, and use a pressure of 80Mpa to uniaxially compact the powder into a metal tablet at room temperature.

[0035] (4) Put the pressed metal sheet into the copper crucible of the WK-II non-consumable electric arc furnace, and evacuate the electric arc furnace with a vacuum degree of 3×10 -3 Pa; refill with inert gas; vacuum again, repeat 2 times; finally melt under the protection of inert gas, the melting voltage is 220V, the melting current is 10A, keep...

Embodiment 2

[0038] (1) Weigh 0.10g of Al powder, 15.90g of Sn powder, and 4.00g of Bi powder into a ball mill jar.

[0039] (2) Add stainless steel balls, 3 large balls of φ20mm, 55 medium balls of φ10mm, and 80 small balls of φ6mm into the tank where the raw materials have been added; -3 Pa; then fill in an inert gas, and finally put it into a planetary ball mill for ball milling and mixing, the rotating speed is 180rad / min, and the ball milling time is 3 hours.

[0040] (3) Tablet the ball-milled powder, take the uniformly mixed powder and put it into a powder mold, and use a pressure of 90 MPa to uniaxially compact the powder into a metal tablet at room temperature.

[0041] (4) Put the pressed metal sheet into the copper crucible of WK-II non-consumable electric arc furnace, and vacuumize the electric arc furnace, and the vacuum degree is controlled at 4×10 -3 Pa; refill inert gas; then vacuumize, repeat 3 times; finally melt under the protection of inert gas, the melting voltage is ...

Embodiment 3

[0044] (1) Weigh 0.20g of Al powder, 15.80g of Sn powder, and 4.00g of Bi powder into a ball mill jar.

[0045] (2) Add stainless steel balls, 3 large balls of φ20mm, 50 medium balls of φ10mm, and 90 small balls of φ6mm into the tank where the raw materials have been added; -3 Pa; then fill in an inert gas, and finally put it into a planetary ball mill for ball milling and mixing, the rotating speed is 170rad / min, and the ball milling time is 4 hours.

[0046] (3) Tablet the ball-milled powder, take the uniformly mixed powder and put it into a powder mold, and use a pressure of 100Mpa to uniaxially compact the powder into a metal tablet at room temperature.

[0047] (4) Put the pressed metal sheet into the copper crucible of WK-II non-consumable electric arc furnace, and vacuum the electric arc furnace, and the vacuum degree is controlled at 5×10 -3 Pa; refill inert gas; then vacuumize, repeat 5 times; finally melt under the protection of inert gas, the melting voltage is 220...

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Abstract

The invention discloses a low-melting-point Sn-Bi-Al series lead-free solder alloy material and a preparation method thereof. The low-melting-point Sn-Bi-Al series lead-free solder alloy material is prepared from the following components in percentage by weight: 15 percent to 25 percent of Bi, 0.5 percent to 2 percent of Al and the balance of Sn. The preparation method of the low-melting-point Sn-Bi-Al series lead-free solder alloy material comprises the following steps: firstly, weighing corresponding metal powder raw materials according to the weight percent of each component; mixing the metal powder by utilizing a planetary ball mill and carrying out mechanical alloying; then pressing the mixed powder into a metal block; finally, smelting by utilizing a non-self-consumption vacuum electric arc furnace; after cooling, obtaining a solder alloy casting ingot. The preparation method disclosed by the invention can be used for carrying out structure refining on solders, and aluminum particles also can be uniformly distributed in a solder alloy; the technical difficulty that aluminum and a tin-bismuth alloy are not easy to mutually smelt is solved and an enhanced phase is formed; the microscopic rigidity of the solders and the conductivity of the solders are effectively improved.

Description

technical field [0001] The invention belongs to the technical field of lead-free solder, in particular to a low melting point Sn-Bi-Al lead-free solder alloy material and a preparation method thereof. Background technique [0002] For a long time, Sn-Pb solder alloy has been considered the most suitable solder in the global electronics industry because of its excellent soldering performance, low price, and abundant reserves. It has the reputation of "glue" in the electronics industry and the machinery industry. However, with the strengthening of people's awareness of environmental protection, it is gradually recognized that the toxicity of Pb and its compounds is harmful to humans and nature. Countries such as the United States, the European Union, Japan, and China have issued laws and regulations to restrict the use of Pb in various products in order to accelerate the process of lead-free. In addition, the thermal expansion coefficient of tin-lead solder does not match, it...

Claims

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Application Information

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IPC IPC(8): C22C13/02C22C1/02B23K35/26
CPCC22C13/02B23K35/262C22C1/02
Inventor 湛永钟李吉东李逸泰杨文超吴凯峰吕阳丁晓龙
Owner GUANGXI UNIV
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