Improved ballistocardiogram signal system
A ballistocardiogram and signal system technology, applied in medical science, sensors, diagnostic recording/measurement, etc., can solve problems such as the inability to clearly judge heart beats, and achieve the effect of avoiding system insensitivity and improving sensitivity
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Embodiment 1
[0026] An improved ballistic cardiogram signal system, which includes a ballistic cardiogram signal collection and conduction device and an extremely low frequency micro-vibration signal sensor. The ballistic cardiogram signal collection and conduction device includes a vibration collection panel 2, a conductive sheet 3, and a support 6. Bottom plate 1. The extremely low frequency micro-vibration signal sensor 4 is installed on the bottom plate 1. The vibration collection panel 2 is installed on the bottom plate 1 through a support 6 with a certain thickness. The upper surface of the conductive sheet 3 supports the vibration collection panel On the bottom surface of 2, the lower surface of the conductive sheet 3 is against the center position of the upper part of the extremely low frequency micro-vibration signal sensor 4. Such as image 3 with Figure 4 As shown, the vibration collecting panel 2 and the bottom plate 1 are kept substantially parallel. Except for the contact part...
Embodiment 2
[0031] Such as Figure 4 with Image 6 As shown, the vibration collection panel 2 provided by this embodiment and the bottom plate 1 are circular in shape and match in size. The bottom plate 1 is provided with a cylindrical support 6 with a height, and the support 6 is provided with a Mounting hole, the vibration collection panel 2 is provided with a mounting hole 5, through the two opposite mounting holes through fasteners, in this way, the vibration collection panel 2 and the bottom plate 1 are fixed at points, which also forms an internal support point. 压板体。 Press plate body.
[0032] In addition, the bottom plate 1 must have good rigidity. The material can be steel plate, carbon fiber board, glass fiber board, etc. When the material is not sufficiently rigid, it can be solved by increasing the thickness of the plate. The requirements of the vibration collection panel are the same as the original patent CN105726036A, that is, the vibration collection panel is a creep-resistant...
Embodiment 3
[0035] Such as Figure 4 with Image 6 As shown, the vibration collection panel 2 provided by this embodiment is integrated with the bottom plate 1. Through 3D printing or machine tool processing, the whole plate is processed into the shape of "Semi-I", but the extremely low frequency The micro-vibration signal sensor 4 is embedded between the upper and lower layers, and the effect of Embodiment 1 can also be achieved.
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