Automatic silicon chip insertion equipment with cleaning function

Abstract

The invention discloses automatic silicon chip insertion equipment with a cleaning function. The automatic silicon chip insertion equipment includes a discharge hopper, a cleaning tank, a material receiving cleaner, a turn-over cleaner, a chip transfer and insertion device and a chip insertion rack. The automatic silicon chip insertion equipment with a cleaning function can enable chip insertion of silicon wafers to be performed automatically, reduces artificial participation, improves chip insertion quality and efficiency, and the silicon chips can be turned over to be cleaned, thereby ensuring cleanliness and tidiness, and facilitating subsequent production.

Description

【Technical field】 [0001] The invention relates to the technical field of silicon wafer production, in particular to the technical field of automatic silicon wafer insertion equipment. 【Background technique】 [0002] Since the beginning of the 21st century, global energy consumption has risen sharply, and traditional fossil energy has been increasingly exhausted. Energy issues and environmental issues have gradually become two major issues of global concern. Under the pressure of sustainable development, major countries have listed the solar photovoltaic industry as the focus of the development and utilization of renewable energy. Silicon wafers are made of silicon rods by cutting and degumming. After the degumming is completed, the silicon wafers need to be divided into pieces, and then the pieces are inserted into the flower basket, and then subsequent cleaning and other processes are performed; in the prior art, the silicon wafers are The steps of slicing and inserting in...

AI Technical Summary

Problems solved by technology

Silicon wafers are made of silicon rods by cutting and degumming. After the degumming is completed, the silicon wafers need to be divided into pieces, and then the pieces are inserted into the flower basket, and then subsequent cleaning and other processes are performed; in the prior art, the silicon wafers are The steps of slicing and inserting into the flower basket are basically done manually, so the efficiency of the operator is low during the operation, and the operator is vulnerable to injury, the silicon wafer is easily damaged, and the silicon wafer is easily contaminated

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