Semiconductor laser fast self-alignment fiber shaping method
A laser and semiconductor technology, used in semiconductor lasers, lasers, laser parts and other directions, can solve the problems of complex structure and process, high cost, unfavorable mass production of products, etc., to solve work drawbacks, improve process requirements, and reduce damage rates Effect
Active Publication Date: 2018-08-10
Shandong Huaguang Optoelectronics Co. Ltd.
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Problems solved by technology
This method can achieve high power, but due to the use of a complex optical calibration system, the purchase of equipment is more cumbersome, the structure and process are more complicated, and the cost of manufacturing and processing is relatively high, which is not conducive to mass production of products
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[0021] In the semiconductor laser fast self-aligning optical fiber shaping method of the present invention, at first make a figure 2 The tooling shown is a stepped cylinder with an inner hole, on which a fiber positioning groove 5 is arranged, and a tooling positioning groove 6 is arranged on the outside thereof, and the fiber positioning groove 5 and the tooling positioning groove 6 are vertical. figure 2 The primary purpose of the optical fiber positioning groove 5 in the optical fiber is to store the optical fiber 7 used for shaping, so as to ensure that the optical fiber 7 will not be damaged or moved during the shaping process. The brightness of light sources is not attenuated after shaping. After the tube base 2 of the semiconductor laser is fitted into the shaping tool, it is used to realize the positioning of the tube base 2 and the tool through the cooperation of the positioning groove 6 of the tool and the positioning groove 4 of the tube base. 7 parallel. The op...
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The invention provides a semiconductor laser fast self-alignment fiber shaping method, which comprises the following steps: 1) placing a semiconductor laser in a tool, wherein the tool has an inner hole, the top end of the tool is provided with a fiber positioning groove, and the outer side thereof is provided with a tool positioning groove, the fiber positioning groove and the tool positioning groove being vertical; 2) enabling a tube base positioning groove and the tool positioning groove to be overlapped to realize positioning of the semiconductor laser in the tool and enable the light output surface of a light-emitting chip to be parallel to the fiber; and 3) placing a shaping fiber in the fiber positioning groove, fixing the fiber and shaping the semiconductor laser. The shaping method can realize a self-alignment function, and solves the detects in many technical aspects in fiber shaping of the semiconductor laser, solves the defect that the fiber is not easy to adjust in the shaping process and solves the work defect of manual shaping, thereby not only reducing fiber damage, but also greatly improving work efficiency under the premise of ensuring technical requirements.
Description
technical field [0001] The invention relates to a device for shaping optical fibers of semiconductor lasers, belonging to the technical field of laser manufacturing. Background technique [0002] After decades of development, semiconductor lasers have become more and more well-known, and their application fields have become more and more extensive. The appearance and volume of semiconductor lasers are small, and the weight is relatively light in the same field. Various advantages determine that they are widely used in many fields such as industry, military, medical treatment, and education. The technical production field of semiconductor lasers has gradually become the focus of the market and the focus of research in various countries. [0003] In recent years, semiconductor laser technology has developed rapidly. With the rapid development of semiconductor material epitaxial growth technology, semiconductor laser waveguide structure optimization technology and cavity surfa...
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IPC IPC(8): H01S5/00G02B27/09
CPCG02B27/0922G02B27/0994H01S5/0057
Inventor 汤庆敏赵克宁徐现刚
Owner Shandong Huaguang Optoelectronics Co. Ltd.