Vapor chamber cooling device with heat conduction pipe

Abstract

The invention discloses a vapor chamber cooling device with a heat conduction pipe. The cooling device comprises a temperature sensor, a capillary core module, cooling fins, a vapor chamber and a controller; a heating element is arranged below the capillary core module, a supporting table is arranged below the heating element, the heat conduction pipe is arranged above the capillary core module, the vapor chamber is connected to the upper portion of the heat conduction pipe, the side, away from the temperature sensor, of the vapor chamber is provided with an electric motor. The device has thebeneficial effects that the cooling effect is better, the heat transfer speed is higher, the use is more convenient and rapid, the temperature equilibrium performance is better, output power is larger, the manufacturing cost is low, the cost performance is higher, the service life is longer, the weight is smaller, the structural design is compact, mounting is more convenient, the device is suitable for cooling work of multiple areas, practicability is higher, the temperature state of the vapor chamber can be actively monitored, active cooling is achieved, and the intelligence degree is higher.

Description

technical field [0001] The invention relates to the field of electrical heat dissipation equipment, in particular to a vapor chamber heat dissipation device with heat conduction pipes. Background technique [0002] Vapor chambers are named after the main features of the components. According to the principle of using the latent heat of the working fluid in the phase change to transport a large amount of heat for heat transfer, it can be classified as a flat heat pipe. Based on this principle, it can also be called It is a vapor chamber or a steam sheet, etc. The application range of the vapor chamber: it is especially suitable for the heat dissipation requirements in a narrow space environment where the height space is strictly limited. Such as laptops, computer workstations and network servers. It is suitable for the working environment where the junction temperature is high and the temperature needs to be rapidly cooled step by step. Such as heat dissipation of high-powe...

AI Technical Summary

Problems solved by technology

As a heat transfer element, the vapor chamber can provide the heat dissipation requirements of the electronics industry and other industries. Traditional vapor chamber cooling equipment has slow heat transfer speed, poor temperature uniformity, high power, and high power consumption. Manufacturing High cost, short service life, large volume, inconvenient installation, suitable for heat dissipation of large equipment, poor practicability

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