Fingerprint sensing module and manufacturing method thereof
A manufacturing method and fingerprint technology, which is applied in semiconductor/solid-state device manufacturing, character and pattern recognition, instruments, etc., can solve the problems of complicated manufacturing process, large overall volume and thick thickness of the fingerprint packaging module, and achieve the effect of simple manufacturing method
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0012] Figure 1A to Figure 1E They are schematic diagrams formed in each step of the method for manufacturing the fingerprint sensor module according to an embodiment of the present invention. Please cooperate with reference in order Figure 1A to Figure 1E .
[0013] First, the prefabricated layer 120 is formed on the circuit substrate 110. See Figure 1A In detail, a mold (not shown) can be used to pour a molding material on the surface 110a of the circuit substrate 110 to form the prefabricated layer 120 with at least one slot H1. The slot H1 communicates with the upper surface and the lower surface of the prefab layer 120, that is, the slot H1 can expose a part of the surface 110a of the circuit substrate 110. In addition, the diameter and width of the slot H1 may be greater than the size of the fingerprint sensing chip 130 so as to be used to accommodate the fingerprint sensing chip 130 in the subsequent process. To avoid reducing the sensitivity of the fingerprint sensor c...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2023 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap