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Fingerprint sensing module and manufacturing method thereof

A manufacturing method and fingerprint technology, which is applied in semiconductor/solid-state device manufacturing, character and pattern recognition, instruments, etc., can solve the problems of complicated manufacturing process, large overall volume and thick thickness of the fingerprint packaging module, and achieve the effect of simple manufacturing method

Inactive Publication Date: 2018-08-14
MOREVALUED TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conventional manufacturing method of the fingerprint sensor module must at least go through a wire bonding machine and a mold, and the manufacturing process is complicated.
Moreover, the overall volume and thickness of the conventional fingerprint encapsulation module is large, so it is difficult to further reduce the overall thickness of the electronic device

Method used

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  • Fingerprint sensing module and manufacturing method thereof
  • Fingerprint sensing module and manufacturing method thereof
  • Fingerprint sensing module and manufacturing method thereof

Examples

Experimental program
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Embodiment Construction

[0012] Figure 1A to Figure 1E Each is a schematic view of each step in the manufacturing method of the fingerprint sensing module according to an embodiment of the present invention. Please refer to Figure 1A to Figure 1E .

[0013] Firstly, a prefabricated layer 120 is formed on the circuit substrate 110 . see Figure 1A In detail, the molding material can be poured on the surface 110 a of the circuit substrate 110 through a mold (not shown), so that it is formed into a prefabricated layer 120 having at least one slot H1 . The slot H1 communicates with the upper surface and the lower surface of the prefabricated layer 120 , that is, the slot H1 can expose a part of the surface 110 a of the circuit substrate 110 . In addition, the width of the slot H1 may be greater than the size of the fingerprint sensing chip 130 so as to accommodate the fingerprint sensing chip 130 in subsequent processes. To avoid reducing the sensitivity of the fingerprint sensing chip 130 , in an em...

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Abstract

A manufacturing method of a fingerprint sensing package module comprises the steps of forming a pre-fabrication layer on a circuit substrate, wherein the pre-fabrication layer comprises at least one groove hole; arranging at least one fingerprint sensing chip on the circuit substrate in the groove hole, wherein the fingerprint sensing chip is provided with a sensing surface, and the sensing surface is arranged at one side relative to the circuit substrate; forming a package body in the groove hole, wherein the package body covers locally the fingerprint sensing chip; cutting a side of the groove hole corresponding to the pre-fabrication layer to form at least one fingerprint sensing unit; and arranging a coverage layer on the fingerprint sensing unit.

Description

technical field [0001] A fingerprint sensing module and a manufacturing method thereof, in particular to a fingerprint sensing module with a covering layer. Background technique [0002] With the development of science and technology, electronic devices such as mobile phones, personal notebook computers or tablets have become necessary tools in life, and the information stored in these electronic systems, such as contacts and photos, is increasing day by day, which has become quite personal. characteristics. In order to prevent important information from being lost or stolen, fingerprint sensing package modules have been widely used in electronic devices nowadays. [0003] In the current common fingerprint sensing module, the fingerprint sensing chip is electrically connected to the circuit substrate through wire bonding, and then the molding material is used to cover the fingerprint sensing chip through a mold. In addition, the thickness of the molding material must be hi...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L21/56H01L23/31G06K9/00
CPCH01L21/50H01L21/56H01L23/3121G06V40/13H01L2224/97H01L2224/16225
Inventor 林炜挺
Owner MOREVALUED TECHNOLOGY CO LTD
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