[0012] Figure 1A to Figure 1E They are schematic diagrams formed in each step of the method for manufacturing the fingerprint sensor module according to an embodiment of the present invention. Please cooperate with reference in order Figure 1A to Figure 1E.
[0013] First, the prefabricated layer 120 is formed on the circuit substrate 110. See Figure 1A In detail, a mold (not shown) can be used to pour a molding material on the surface 110a of the circuit substrate 110 to form the prefabricated layer 120 with at least one slot H1. The slot H1 communicates with the upper surface and the lower surface of the prefab layer 120, that is, the slot H1 can expose a part of the surface 110a of the circuit substrate 110. In addition, the diameter and width of the slot H1 may be greater than the size of the fingerprint sensing chip 130 so as to be used to accommodate the fingerprint sensing chip 130 in the subsequent process. To avoid reducing the sensitivity of the fingerprint sensor chip 130, in one embodiment, the thickness 120h of the prefabricated layer 120 may be less than or equal to the height 130h of the fingerprint sensor chip 130. The circuit substrate 110 may specifically be a large-sized circuit substrate panel (circuit substrate panel or circuit substrate strip), and the surface 110a of the circuit substrate 110 may be electrically designed with pads (not shown) or lines (not shown). ) And other circuit wiring. In fact, these pads and circuits can be designed according to the configuration requirements of the subsequent fingerprint sensor chip 130. The material of the prefabricated layer 120 may be a molding material commonly used in general packaging, such as but not limited to epoxy molding compound (EMC).
[0014] Next, at least one fingerprint sensor chip 130 is disposed on the circuit substrate 110 in the at least one slot H1. See Figure 1B In detail, the fingerprint sensing chip 130 has a sensing surface 130a and a non-sensing surface 130b opposite to the sensing surface 130a, wherein the sensing surface 130a is the surface of the fingerprint sensing chip 130 with a sensing area. The sensing surface 130a is located on a side opposite to the circuit substrate 110, that is, the non-sensing surface 130b of the fingerprint sensor chip 130 is combined with the circuit substrate 110. In an embodiment, the fingerprint sensor chip 130 may include a through silicon via (TSV) (not shown), and the through silicon via electrode may electrically conduct the electrical contacts on the sensing surface 130a to Non-sensing surface 130b. In this embodiment, the fingerprint sensor chip 130 can use surface mount technology (SMT) to form the non-sensing surface 130b of the fingerprint sensor chip 130 with bumps, solder paste or solder balls. T1 etc. are adhered to the surface of the circuit board 110.
[0015] Next, the package body 140 is formed in the slot H1. See Figure 1C In detail, the package body 140 can be a liquid molding material or underfill, and the package body 140 is filled in the slot H1 and the fingerprint sensor chip 130 and tin through a dispensing process (dispensing) The gap between the balls T1, and covers a part of the fingerprint sensor chip 130. It should be noted that, in order to avoid reducing the sensitivity of the fingerprint sensor chip 130, in an embodiment, the thickness 140h of the package body 140 may be less than or equal to the height 130h of the fingerprint sensor chip 130. In other words, the package body 140 may expose the sensing surface 130a of the fingerprint sensing chip 130.
[0016] Next, the unitization step is performed. See Figure 1D , The side of the slot H1 corresponding to the prefabricated layer 120 is cut to form at least one fingerprint sensing unit U1. The fingerprint sensing unit U1 is defined as the unit to be obtained in this unitization process. It is worth mentioning that the package body 140 and the circuit substrate 110 can be cut through a cutter or a laser to perform a unitization process.
[0017] Then, the cover layer 150 is disposed on the fingerprint sensing unit U1. See Figure 1E Specifically, an adhesive material (not shown) is applied to the surface of the package body 140 of the fingerprint sensing unit U1 or the surface of the cover layer 150, and then the cover layer 150 is adhered to the fingerprint sensor by the adhesive material On the package body 140 of the unit U1. The viscous material can be, but is not limited to, double-sided tape, liquid glue, viscous ink or viscous paint. In addition, this embodiment of the manufacturing method of the fingerprint sensor module may further include the step of forming the color layer C1 on the cover layer 150, that is, the color layer C1 may be coated on the cover layer 150 first, and then the adhesive The material is formed on the surface of the color layer C1 or the surface of the package body 140 of the fingerprint sensing unit U1 to attach the cover layer 150 with the color layer C1 to the fingerprint sensing unit U1. It should be noted that the covering layer 150 is used to provide a user's finger touch. In an embodiment, the cover layer 150 may be a light-transmissive substrate, such as a glass substrate, a plastic substrate, a sapphire substrate, or a touch cover plate applied to a touch device, etc., so that the cover layer 150 The color of the color layer C1 below the layer 150. Here, the fingerprint sensing module 100 is generally formed.
[0018] Figure 2A to Figure 2D It is a schematic diagram formed in each step of a method for manufacturing a fingerprint sensor module according to another embodiment of the present invention. Please refer to in order Figure 2A to Figure 2D.
[0019] Firstly, at least one fingerprint sensor chip 130 is arranged on the circuit substrate 110. See Figure 2A In detail, the sensing surface 130a of the fingerprint sensing chip 130 is located on a side opposite to the circuit substrate 110, and the non-sensing surface 130b of the fingerprint sensing chip 130 is combined with the circuit substrate 110. In one embodiment, the fingerprint sensing chip 130 may include through silicon via electrodes (not shown), and the through silicon via electrodes may electrically conduct the electrical contacts on the sensing surface 130a to the non-sensing surface 130b. In this embodiment, the fingerprint sensor chip 130 can adhere the non-sensing surface 130b of the fingerprint sensor chip 130 to the surface of the circuit substrate 110 with bumps, solder paste, or solder balls T1 through surface adhesion technology.
[0020] Next, see Figure 2B , The package body 140 is arranged on the circuit substrate 110 to cover the fingerprint sensor chip 130. In this embodiment, the material of the package body 140 may be an underfill, which is attached to the circuit substrate 110 through a dispensing process and covers a part of the fingerprint sensor chip 130. However, in other embodiments, the material of the package body 140 may be a layer of adhesive prepreg material (Preimpregnated Material), such as but not limited to epoxy resin (Epoxyresin), glass fiber prepreg material (Glass fiber prepreg). ), Carbon fiber prepreg and other materials. The package body 140 has adhesiveness and can be directly adhered to the circuit substrate 110 and covers the fingerprint sensor chip 130. It should be noted that, in order to avoid reducing the sensitivity of the fingerprint sensor chip 130, in an embodiment, the thickness 140h of the package body 140 may be less than or equal to the height 130h of the fingerprint sensor chip 130. In other words, the package body 140 may expose the sensing surface 130a of the fingerprint sensing chip 130.
[0021] Next, proceed to the unitization process, please refer to Figure 2C , Cutting the package body 140 to form at least one fingerprint sensing unit U2. In detail, the package body 140 and the circuit substrate 110 can be cut through a cutter or a laser corresponding to the upper surface of the package body 140, so that each fingerprint sensing unit U2 includes at least one fingerprint sensing chip 130 to perform the unit 化process. The fingerprint sensing unit U2 is defined as the unit obtained in the unitization process of this embodiment. Since this embodiment does not include the step of forming the prefabricated layer 120 on the circuit substrate 110, there is a difference between the fingerprint sensing unit U2 and the fingerprint sensing unit U12. The difference between the fingerprint sensing unit U2 and the fingerprint sensing unit U12 is that the fingerprint sensing unit U1 has a prefabricated layer 120.
[0022] Then, the cover layer 150 is disposed on the fingerprint sensing unit U2. See Figure 2D , Apply the adhesive material A1 on the surface of the package body 140 of the fingerprint sensing unit U2 or the surface of the cover layer 150, and then stick the cover layer 150 on the package body 160 of the fingerprint sensor unit U2 with the adhesive material A1 . The viscous material A1 can be, but is not limited to, double-sided tape, liquid glue, viscous ink or viscous paint. In addition, this embodiment of the manufacturing method of the fingerprint sensor module may further include the step of forming the color layer C1 on the cover layer 150, that is, the color layer C1 may be coated on the cover layer 150 first, and then the adhesive The material A1 is formed on the surface of the color layer C1 or the surface of the package body 140 of the fingerprint sensing unit U1 to attach the cover layer 150 with the color layer C1 to the fingerprint sensing unit U1. It should be noted that the covering layer 150 is used to provide a user's finger touch. In an embodiment, the cover layer 150 may be a light-transmissive substrate, such as a glass substrate, a plastic substrate, a sapphire substrate, or a touch cover plate applied to a touch device, etc., so that the cover layer 150 The color of the color layer C1 below the layer 150. Here, the fingerprint sensing module 200 is generally formed.
[0023] In summary, the embodiments of the present invention provide a fingerprint sensing package module and a manufacturing method thereof. The fingerprint sensing package module of an embodiment of the present invention includes a circuit substrate, a prefabricated layer, a fingerprint sensing chip, a package body and a cover layer. The prefabricated layer provided on the circuit substrate can be used as a support for the overall module, and the fingerprint sensor chip can be accommodated in the slot of the prefabricated layer through surface adhesion technology. Wherein, the thickness of the prefabricated layer may be less than or equal to the height of the fingerprint sensor chip, and the thickness of the package body may be less than or equal to the height of the fingerprint sensor chip. Accordingly, the thickness of the package body is limited compared to the conventional The arc of the wire bonding is high, and the sensing surface of the fingerprint sensing chip can be closer to the covering layer. In other words, the sensing surface of the fingerprint sensor chip is closer to the object to be sensed.
[0024] In addition, the manufacturing method of the fingerprint sensing package module of an embodiment of the present invention includes the step of arranging the prefabricated layer and the step of making the molding compound by the glue dispensing process. Accordingly, compared with the prior art, the method of the present invention The manufacturing method of the fingerprint sensing package module is relatively simple, without the use of complicated equipment and complicated steps.
[0025] In addition, in the manufacturing method of the fingerprint sensing package module according to another embodiment of the present invention, the molding compound can be directly fabricated on the fingerprint sensing chip through a glue dispensing process without the need to provide a prefabricated layer. Accordingly, the manufacturing method of the fingerprint sensing package module of the present invention does not need to use complicated equipment and complicated steps.
[0026] Although the technical content of the present invention has been disclosed in the preferred embodiments as above, it is not intended to limit the present invention. Anyone who is familiar with this technique and makes some changes and modifications without departing from the spirit of the present invention should be covered in this Within the scope of the invention, therefore, the scope of protection of the present invention shall be subject to the scope of the attached patent application.
[0027] 【Symbol Description】
[0028] 100, 200 fingerprint sensor module
[0029] 110 circuit board
[0030] 110a surface
[0031] 120 prefabricated layers
[0032] 120h thickness
[0033] 130 fingerprint sensor chip
[0034] 130a Sensing surface
[0035] 130b Non-sensing surface
[0036] 130h height
[0037] 140 package body
[0038] 140h thickness
[0039] 150 cover
[0040] A1 Adhesive material
[0041] C1 color layer
[0042] H1 slot
[0043] U1, U2 fingerprint sensing unit
[0044] T1 tin ball
