Ultrafast laser micropore machining method and device based on optical coherence tomographic scanning

A technology of optical coherence tomography and microhole processing, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of complex process debugging, long cycle, and damage to the opposite wall, and achieve simple processing and short cycle , The effect of uniform shape of the bottom of the hole

Pending Publication Date: 2018-08-17
XIAN MICROMACH TECH CO LTD
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Problems solved by technology

[0003] The purpose of the present invention is to provide a process method and device for realizing high-precision micro-hole processing by using ultra-fast laser, so as to solve the problem of the opposite wall damage caused by the conical shape of the bottom in micro-hole processing and the resulting complex process debugging and long period and other issues, to achieve high-precision micro-hole intelligent processing

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  • Ultrafast laser micropore machining method and device based on optical coherence tomographic scanning
  • Ultrafast laser micropore machining method and device based on optical coherence tomographic scanning
  • Ultrafast laser micropore machining method and device based on optical coherence tomographic scanning

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[0045] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0046]The present invention adopts optical coherence tomography to coaxially monitor the micropore morphology in the process of processing and real-time control the processing parameters to realize ultra-fast laser microhole processing, which can realize one-stage high-precision microhole processing; firstly, it needs to process the holes according to the workpiece Parameters, determine the initial processing parameters and multiple sets of modified processing parameters; divide the hole-making area into different concentric circles along the radial section of the micro-hole; then start laser scanning to process the micro-hole according to the determined initial processing parameters; In the process of processing, the coaxial monitoring method of optical coherence tomography is used to real-time image the cross-section and depth dimension of the...

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Abstract

The invention discloses an ultrafast laser micropore machining method and device based on optical coherence tomographic scanning. According to the ultrafast laser micropore machining method and device, the pore size, the pore bottom morphology and other features in the pore machining process can be monitored in real time by adopting an imaging system based on optical coherence tomography; the laser power, the scanning mode and other pore machining parameters can be under the feedback control according to the monitoring results; and then the problem about damage to a surface wall can be effectively solved when the micropore machining precision is guaranteed. The ultrafast laser micropore machining method and device disclosed by the invention are applicable to the high-quality machining of blade air-film pores, auto oil nozzle micropores and the like.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a process method and a device for realizing high-precision microhole processing by using an ultrafast laser. Background technique [0002] Ultra-fast laser micro-hole processing technology is the latest technical means for the micro-hole processing of blade air film holes, flame cylinder air film holes and aviation fuel injectors, but the micro holes required in these fields have high precision, good quality and no damage to the opposite wall And other processing requirements. However, in the current process of ultrafast laser microhole processing, due to factors such as differences in lasers, processing environments, and errors in optical path debugging, it has a serious impact on the accuracy of hole making. And various ways such as plasma absorption propagate to the bottom of the hole, making the hole depth increase. However, the reflectivity of the lase...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/384B23K26/082
CPCB23K26/384B23K26/0821
Inventor 贺斌赵卫焦悦田东坡
Owner XIAN MICROMACH TECH CO LTD
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