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Polishing material

A technology of abrasive layer and abrasive grains, which is applied in the direction of abrasives, polishing compositions containing abrasives, and other chemical processes, which can solve the problems of reduced grinding efficiency and achieve the effect of excellent grinding rate and difficult reduction of grinding rate

Active Publication Date: 2018-08-21
BANDO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the dressing, the grinding of the glass substrate as the object to be ground is interrupted, so for the existing grinding materials, the reduction of the grinding efficiency caused by dressing is large.

Method used

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Examples

Experimental program
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Effect test

Embodiment approach

[0081] The present invention is not limited to the above-described embodiments, and can be implemented as various changes and improvements other than the above-described aspects. In the above-described embodiment, the grooves are formed in a grid with equal intervals, but the intervals of the grids may not be equal intervals, for example, the intervals may be changed in the vertical and horizontal directions. However, when the intervals of the grooves are different, there is a possibility that anisotropy will be generated in polishing, so the intervals are preferably equal.

[0082] In addition, the planar shape of the grooves does not need to be a grid shape, for example, a shape in which polygons other than quadrilaterals are repeated, a circular shape, a shape with a plurality of parallel lines, etc., or may be concentric circles. In addition, the planar shape of the grooves may be stripes arranged in only one direction.

[0083] In the above-mentioned embodiment, a method...

Embodiment 1

[0092] Diamond abrasive grains were prepared, and the average particle diameter was measured using "Microtrac MT3300EXII" manufactured by Nikkiso Co., Ltd. The average particle size of the diamond abrasive grains is 44 μm. Furthermore, the type of the diamond abrasive grains is treated diamond obtained by coating 55 mass% (mass percent) nickel on single crystal diamond.

[0093] Silicate (No. 3 sodium silicate), the diamond abrasive grains and alumina (Al 2 o 3 , average particle diameter is 12 μm) mix, become 30vol% and the mode adjustment that the content of filler relative to abrasive layer becomes 40vol% with the content of diamond abrasive grain relative to abrasive layer, obtain the coating liquid of composition for abrasive layer.

[0094] In addition, silicate (No. 3 sodium silicate), and alumina (Al 2 o 3 , with an average particle diameter of 12 μm) were mixed and adjusted so that the content of the filler relative to the filled portion became 70 vol%, to obtain ...

Embodiment 2～ Embodiment 6

[0100] The area of ​​the convex portion in Example 1 and the area occupancy ratio with respect to the entire polishing layer were changed as shown in Table 1 to obtain abrasive materials of Examples 2 to 6.

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Abstract

The purpose of the present invention is to provide a polishing material which has excellent polishing rate and is not susceptible to decrease of the polishing rate for a relatively long period of time. The present invention is a polishing material which is provided with: a base sheet; and a polishing layer that is laminated on the front surface of the base sheet and contains abrasive grains and abinder for the abrasive grains. This polishing material is characterized in that: the binder is mainly composed of an inorganic material; the polishing layer has a plurality of projected portions in the surface, said projected portions being divided by grooves; the average area of the projected portions is from 1 mm2 to 300 mm2 (inclusive); and the total area occupancy of the plurality of projected portions relative to the whole area of the polishing layer is from 4% to 15% (inclusive). It is preferable that this polishing material is additionally provided with filler parts which are filled into the grooves and are mainly composed of a resin or an inorganic material, and which do not substantially contain abrasive grains. It is preferable that the ratio of the average thickness of the filler parts to the average thickness of the polishing layer is from 0.1 to 1 (inclusive). It is preferable that the abrasive grains are diamond abrasive grains. It is preferable that the inorganic material is a silicate.

Description

technical field [0001] The invention relates to a grinding material. Background technique [0002] In recent years, the precision of electronic devices such as hard disks has advanced. As a substrate material for such electronic devices, glass is often used in consideration of rigidity, impact resistance, and heat resistance that can cope with miniaturization or thinning. The glass substrate is a brittle material, and its mechanical strength is significantly impaired due to surface damage. Therefore, in polishing of such a substrate, planarization accuracy with a polishing rate and less damage is required. [0003] Generally, if it is desired to improve the planarization accuracy of the finishing process, the processing time tends to be prolonged, and the polishing rate and the planarization accuracy are in a trade-off relationship. Therefore, it is difficult to achieve both polishing rate and planarization accuracy. In contrast, there has been proposed an abrasive mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D11/00B24D3/00B24D3/14C09G1/02C09K3/14
CPCB24D3/00B24D3/14B24D11/00C09G1/02C09K3/14
Inventor 下山贤治西藤和夫笹岛启佑田浦歳和
Owner BANDO CHEM IND LTD
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