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Abrasives

A technology of abrasive layer and abrasive grains, which is applied in the direction of abrasives, polishing compositions containing abrasives, and other chemical processes, which can solve the problems of reduced grinding efficiency and achieve excellent grinding rate and the effect that the grinding rate is not easy to decrease

Active Publication Date: 2020-11-10
BANDO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the dressing, the grinding of the glass substrate as the object to be ground is interrupted, so for the existing grinding materials, the reduction of the grinding efficiency caused by dressing is large.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0093] The present invention is not limited to the above-described embodiments, and can be implemented as various changes and improvements other than the above-described aspects. In the above-described embodiment, the grooves are formed in a grid with equal intervals, but the intervals of the grids may not be equal intervals, for example, the intervals may be changed in the vertical and horizontal directions. However, when the intervals of the grooves are different, there is a possibility that anisotropy will be generated in polishing, so the intervals are preferably equal.

[0094] In addition, the planar shape of the grooves does not need to be a grid shape, for example, a shape in which polygons other than quadrilaterals are repeated, a circular shape, a shape with a plurality of parallel lines, etc., or may be concentric circles. In addition, the planar shape of the grooves may be stripes arranged in only one direction.

[0095] In the above-mentioned embodiment, a method...

Embodiment 1

[0104] Diamond abrasive grains were prepared, and the average particle diameter was measured using "Microtrac MT3300EXII" manufactured by Nikkiso Co., Ltd. The average particle size of the diamond abrasive grains is 44 μm. Furthermore, the type of the diamond abrasive grains is treated diamond obtained by coating 55 mass% (mass percent) nickel on single crystal diamond.

[0105] Silicate (No. 3 sodium silicate), the diamond abrasive grains and alumina (Al 2 o 3 , average particle diameter is 12 μm) mix, become 30vol% and the mode adjustment that the content of filler relative to abrasive layer becomes 40vol% with the content of diamond abrasive grain relative to abrasive layer, obtain the coating liquid of composition for abrasive layer.

[0106] In addition, silicate (No. 3 sodium silicate), and alumina (Al 2 o 3 , with an average particle diameter of 12 μm) were mixed and adjusted so that the content of the filler relative to the filled portion became 70 vol%, to obtain ...

Embodiment 2～ Embodiment 6

[0112] The area of ​​the convex portion in Example 1 and the area occupancy ratio with respect to the entire polishing layer were changed as shown in Table 1 to obtain abrasive materials of Examples 2 to 6.

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Abstract

An object of the present invention is to provide an abrasive which is excellent in grinding rate and which does not tend to decrease in grinding rate over a relatively long period of time. The abrasive material has a substrate sheet, and a polishing layer laminated on the surface side of the substrate sheet and containing abrasive grains and a binder thereof, wherein the main component of the binder is an inorganic substance, and the abrasive The layer has on its surface a plurality of convex portions divided by grooves, the average area of ​​the convex portions being 1 mm 2 Above and 300mm 2 Hereinafter, the total area occupancy of the plurality of convex portions with respect to the entire polishing layer is not less than 4% and not more than 15%. The abrasive material may further include a filling portion which is filled into the groove, has a resin or an inorganic substance as a main component, and substantially does not contain abrasive grains. The ratio of the average thickness of the filled portion to the average thickness of the polishing layer is preferably 0.1 or more and 1 or less. The abrasive grains may be diamond abrasive grains. The inorganic substance may be a silicate.

Description

technical field [0001] The invention relates to a grinding material. Background technique [0002] In recent years, the precision of electronic devices such as hard disks has advanced. As a substrate material for such electronic devices, glass is often used in consideration of rigidity, impact resistance, and heat resistance that can cope with miniaturization or thinning. The glass substrate is a brittle material, and its mechanical strength is significantly impaired due to surface damage. Therefore, in polishing of such a substrate, planarization accuracy with a polishing rate and less damage is required. [0003] Generally, if it is desired to improve the planarization accuracy of the finishing process, the processing time tends to be prolonged, and the polishing rate and the planarization accuracy are in a trade-off relationship. Therefore, it is difficult to achieve both polishing rate and planarization accuracy. In contrast, there has been proposed an abrasive mater...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D11/00B24D3/00B24D3/14C09G1/02C09K3/14
CPCB24D3/00B24D3/14B24D11/00C09G1/02C09K3/14
Inventor 下山贤治西藤和夫笹岛启佑田浦歳和
Owner BANDO CHEM IND LTD
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