Phosphor plate package, light-emitting package, and vehicle head lamp comprising same

A phosphor and packaging technology, applied in semiconductor devices of light-emitting elements, headlights, road vehicles, etc., can solve the problems of reduced transmittance, reduced brightness, reduced transmittance and brightness, etc., to improve transmittance and improve productivity. Effect

Inactive Publication Date: 2018-08-21
LG INNOTEK CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are problems in that transmittance decreases due to addition of inorganic particles, etc., and brightness decreases due to backscattering
[0004] In addition, since polymer resin should be used as an adhesive layer, a carbonization phenomenon occurs in the adhesive layer due to heat generated by its manufacturing process or its use, which leads to a decrease in transmittance and brightness

Method used

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  • Phosphor plate package, light-emitting package, and vehicle head lamp comprising same
  • Phosphor plate package, light-emitting package, and vehicle head lamp comprising same
  • Phosphor plate package, light-emitting package, and vehicle head lamp comprising same

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Embodiment Construction

[0018] Hereinafter, exemplary embodiments of the present invention that can be easily carried out by those skilled in the art will be described in detail with reference to the accompanying drawings. However, the embodiments described in this specification and the configurations shown in the drawings are merely illustrative examples of the present invention. It should be understood that this invention encompasses various equivalents and modifications that may be substituted for the embodiments and drawings herein at the time of filing this application. Also, in the detailed description of the operating principle of the exemplary embodiments of the present invention, when it is determined that the detailed description of related well-known functions and configurations unnecessarily obscures the gist of the present invention, the detailed description thereof will be omitted. Some terms described below are defined in consideration of functions in the present invention. Therefore,...

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Abstract

An embodiment of the present invention comprises: a substrate; a phosphor plate disposed on a surface of the substrate; and a glass paste layer disposed between the substrate and the phosphor plate.

Description

technical field [0001] The present invention relates to a phosphor panel package having a wide light distribution, a light emitting package and a vehicle headlamp comprising the phosphor panel package. Background technique [0002] A laser diode (LD) has an advantage of high luminosity, but has a disadvantage in that it is difficult to apply the LD to vehicle headlights requiring wide light distribution due to its weak light spreadability. [0003] In order to improve light spreadability of LDs, a technique of increasing light diffusivity by adding inorganic particles or the like to an adhesive layer interposed between a phosphor plate and a substrate has become common. However, there are problems in that transmittance decreases due to addition of inorganic particles and the like, and luminance decreases due to backscattering. [0004] In addition, since polymer resin should be used as the adhesive layer, a carbonization phenomenon occurs in the adhesive layer due to heat g...

Claims

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Application Information

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IPC IPC(8): F21K2/06F21L17/00F21K9/60H05B33/14F21S41/16F21W107/10F21Y115/30
CPCF21L17/00F21K9/60H05B33/12F21S41/16F21S41/176C09K11/02F21S41/00F21K2/06H05B33/14F21Y2115/30F21W2102/00F21Y2101/00
Inventor 元邾瓀金元振孙妏暎
Owner LG INNOTEK CO LTD
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