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Process recipe evaluation method, assisting device for process recipe evaluation, and liquid processing apparatus

A processing solution, liquid processing technology, applied in special data processing applications, photoengraving process of patterned surface, semiconductor/solid-state device manufacturing, etc., can solve problems such as contamination of components as a whole

Active Publication Date: 2018-08-28
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At this time, depending on the rotation speed of the wafer in the processing plan, the supply liquid amount of the processing liquid, etc., the liquid splash may easily occur, and the entire module may be polluted, or the spray may accumulate in the nozzle arm to produce dripping liquid.

Method used

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  • Process recipe evaluation method, assisting device for process recipe evaluation, and liquid processing apparatus
  • Process recipe evaluation method, assisting device for process recipe evaluation, and liquid processing apparatus
  • Process recipe evaluation method, assisting device for process recipe evaluation, and liquid processing apparatus

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Embodiment Construction

[0056] Before describing the evaluation apparatus of the processing recipe according to the embodiment of the present invention, as an example of a liquid processing apparatus for processing a substrate using a processing recipe, for example, supplying a developing liquid to an exposed wafer W to perform circuit patterning A developing device for the developing process will be briefly described. Such as figure 1 , figure 2 As shown, the developing device has a developing assembly 2 . The developing unit 2 has a spin chuck 11 as a holding unit that absorbs the central portion of the back surface of the wafer W to hold the wafer W horizontally, and the spin chuck 11 is connected to a rotation mechanism 13 via a rotation shaft 12 . The spin chuck 11 is configured to freely rotate around a vertical axis via a rotation mechanism 13 while holding the wafer W.

[0057] A circular plate 22 is provided on the lower side of the spin chuck 11 so as to surround the rotary shaft 12 wit...

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Abstract

The present invention provides a technique capable of evaluating the risk of liquid splashing of a treatment scheme in a liquid processing apparatus that supplies a processing liquid to a substrate and rotates the substrate to perform liquid processing on the substrate. In a developing device: storing risk data in a first storage part (93), wherein the risk data corresponds to the number of liquidsplash for each combination of the rotating speed of a wafer (W) and the supply position of the developing liquid on the wafer (W); and when the user produces a process recipe, the time-dependent change of the number of liquid splash in the process recipe, the total number of liquid splash in the process recipe, and the liquid splash disk number in each development step are displayed according tothe risk data. Therefore, the user can grasp the liquid splash risk of the reproduced or changed process recipe, thus being able to contribute to the evaluation of the process recipe.

Description

technical field [0001] The present invention relates to a technology for evaluating treatment plans of a liquid processing device for supplying a processing liquid to a substrate for liquid processing and a liquid processing device having the technology. Background technique [0002] In the photolithography step of manufacturing a semiconductor device, a resist film is formed, and a developing liquid is supplied to a substrate exposed along a predetermined pattern to form a resist pattern. For example, as described in Patent Document 1, the developing liquid is discharged from the developing liquid nozzle to a semiconductor wafer (hereinafter referred to as "wafer") held horizontally, and a liquid accumulation is formed on the surface of the wafer W. The rotation of W spreads the accumulated liquid on the wafer W, thereby performing a development process. [0003] In such a developing device, when the rotational speed of the substrate is high, when the developing liquid dis...

Claims

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Application Information

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IPC IPC(8): H01L21/027H01L21/67G03F7/30
CPCG03F7/3028H01L21/0274H01L21/67253G03F7/3021H01L21/027H01L22/20H01L21/6715H01L21/67242G03F7/705H01L21/67023H01L21/67051G06F16/90335
Inventor 鹤田丰久桾本裕一朗羽山隆史滨田佳志
Owner TOKYO ELECTRON LTD
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