A kind of encapsulation method of thermoelectric separation heat dissipation structure for high-power LED

Abstract

The invention discloses a packaging method of a thermoelectricity separation cooling structure of a high-power LED. The thermoelectricity separation cooling structure comprises a cooling base plate and an insulation layer and a cooper foil layer sequentially arranged on the cooling base plate, and a notch A is formed in the insulation layer and a notch B is formed in the copper foil layer successively through a milling technology; the LED packaging structure is arranged in the notch A and the notch B matched with the LED packaging structure, so that a LED base is connected with the cooling base plate, and an LED chip arranged on the LED base is electrically connected with the copper foil layer through electrodes. By adopting the technical scheme and through structural improvement, the LEDpackaging structure can be directly buckled with the notch A and the notch B, because the LED cooling base is directly connected with the cooling base plate, accordingly the heat generated by the LEDchip can be directly transmitted to the cooling base plate, a high thermal resistance insulation layer in a traditional cooling base plate is avoided, and the thermal resistance of the high-power LEDis greatly reduced.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of high-power LEDs, in particular to a packaging method of a thermoelectric separation heat dissipation structure for high-power LEDs. Background technique [0002] With the rapid development of science and technology, people have higher and higher requirements for the luminous power of street lighting. As an excellent semiconductor optoelectronic device, LED has become an ideal solid-state energy-saving lighting source for a new generation due to its advantages of small size, low power consumption, long service life, and environmental protection. With the development of LEDs to high light intensity and high power, the problem of heat dissipation of LEDs has become increasingly prominent. The heat dissipation problem affects the light output characteristics of the LED and the life of the device, and is a key issue in high-power LED packaging. If the heat dissipation of the package is no...

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Problems solved by technology

[0004] In the prior art, high-power LED lamp beads are directly packaged on the traditional aluminum-based copper-clad board (copper foil, insulating layer and aluminum plate from top to bottom), because the heat generated by the LED chip needs to pass through the insulating layer with high thermal resistance, resulting in Low heat dissipation efficiency Poor heat dissipation will increase the temperature of the chip, causing uneven stress distribution, shortening the life, and reducing the conversion efficiency of phosphor powder, resulting in a decrease in the light output efficiency of the chip

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