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Patterned cover layer on base structure defining cavity and alignment marker

A technology for aligning marks and covering layers, which is applied in the fields of electric solid-state devices, semiconductor devices, multilayer circuit manufacturing, etc.

Active Publication Date: 2018-08-28
AT & S AUSTRIA TECH & SYSTTECHN AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Other problems with registration accuracy may also arise in the manufacture of component carriers

Method used

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  • Patterned cover layer on base structure defining cavity and alignment marker
  • Patterned cover layer on base structure defining cavity and alignment marker
  • Patterned cover layer on base structure defining cavity and alignment marker

Examples

Experimental program
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Embodiment Construction

[0048] Before describing the exemplary embodiments in further detail with reference to the accompanying drawings, some basic considerations upon which the exemplary embodiments of the present invention are developed will be outlined.

[0049] According to an exemplary embodiment of the present invention, there is provided a component-embedded package with high accuracy. More specifically, an exemplary embodiment of the present invention provides a package or module with embedded electronics configured such that the entire registration chain becomes efficient and thus can be kept very small. manufacturing tolerances. By taking this measure, a high packing density can be achieved, allowing also a high degree or extensive functionality of the package in which the components are embedded.

[0050]An advantage achievable by exemplary embodiments of the present invention is high quality registration between cavities and components. Furthermore, during the laser cutting process of ...

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Abstract

A method of manufacturing a package (100), wherein the method comprises providing a patterned cover layer (102) on a front side of a base structure (104) to thereby define a position of a cavity (106)to be formed in the base structure (104) and of at least one alignment marker (108) in a common procedure, forming the cavity (106) at the defined position, and removing material of the base structure (104) from a back side to thereby expose the at least one alignment marker (108).

Description

technical field [0001] The invention relates to methods of manufacturing enclosures, semi-finished products and panels. Background technique [0002] In the case of increasing product functions of component carriers equipped with one or more electronic components and the increasing miniaturization of such electronic components and the increase in the number of electronic components to be mounted on component carriers such as printed circuit boards, the use of Increasingly more powerful arrayed components or packages having several electronic components with multiple contacts or connections with increasingly smaller spacing between the contacts. Removal of the heat generated by such electronic components and the component carrier itself during operation is an increasing problem. At the same time, the component carrier should be mechanically robust and electrically reliable in order to be able to operate even under severe conditions. [0003] Furthermore, proper alignment of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/06H05K3/32H05K3/46
CPCH05K1/0266H05K3/06H05K3/32H05K3/4697H05K2203/166H01L23/5389H01L23/544H01L2223/54426H01L2223/54486H01L2224/04105H01L2224/92144H01L2924/3511
Inventor 沃尔夫冈·斯科瑞特维塞尔罗伯特·克里斯坦德安德烈亚斯·费克特纳海因茨·皮尔茨彼得·莫泽
Owner AT & S AUSTRIA TECH & SYSTTECHN AG
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