Preparation method and failure analysis method of bare chip taken from flip chip

Abstract

The invention provides a preparation method and a failure analysis method of a bare chip taken from a flip chip. The preparation method of the bare chip taken from the flip chip comprises the steps ofproviding the flip chip, wherein the flip chip comprises a bare chip and a packaging structure for packaging the exterior of the bare chip, and solder balls are on the front surface of the bare chip;performing grinding on the packaging structure until the solder balls are exposed from the front surface of the bare chip; and performing etching on the front surface of the bare chip by adopting anacid spraying etching mode, removing the solder balls on the front surface of the bare chip and the residual packaging structure until the front surface of the bare chip is completely un-packaged to obtain a bare chip sample. According to the preparation method of the bare chip taken from the flip chip, removal of the packaging structure by acid boiling is not needed, instead, one part of the packaging structure is grinded off, and then the solder balls and the packaging structure on the front surface of the bare chip are removed by adopting the acid spraying etching mode, thereby obtaining the bare chip, without causing edge breakage or cracks; and when the bare chip is used for other experiments, influence of human factors to the bare chip can be eliminated, experiment accuracy can be improved, and an excellent technical effect can be achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for preparing a flip-chip chip and a bare chip and a failure analysis method. Background technique [0002] Due to the rapid development of semiconductor technology, chips with high-end 28nm or even smaller technology have been widely used at home and abroad. The general packaging form can no longer meet the requirements of the chip transmission rate, and the emergence of flip-packaging technology has solved this problem. At present, flip-packaged chips have been widely used in various fields, and advanced packaging such as C4 packaging will become the mainstream in the future. [0003] Because flip-package chips usually have more metal layers, and there are solder balls on the front side. Therefore, sampling failure analysis is usually done after the reliability test. Using fuming nitric acid to pick up the bare chip may be affected by the boiling or thermal ex...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the technical problem of chipping or cracks in the prior art when taking the bare chip from the flip-chip chip, the present invention provides a preparation method for taking the bare chip from the flip-chip chip

Images