Production equipment for semi-finished integrated chip

Abstract

The invention discloses production equipment for a semi-finished integrated chip, and the equipment comprises a processing machine body and a conveying cavity which is disposed in the processing machine body and is laterally through. The interior of the processing machine body is sequentially provided with a metal sputtering coating cavity, a coating photoresistor cavity, a photoetching cavity anda first sliding guide groove from the left to the right, wherein the openings of the metal sputtering coating cavity, the coating photoresistor cavity, the photoetching cavity and the first sliding guide groove are communicated with the conveying cavity and face downwards. The interior of the processing machine body is provided with a second sliding guide groove, wherein the opening of the secondsliding guide groove faces upwards and is communicated with the conveying cavity. The interiors of the front and rear walls of the second sliding guide groove are communicated with guide rail grooveswhich are arranged in symmetry and extend along the second sliding guide groove. The inner wall of the rear end of the second sliding guide groove is provided with first displacement sensors which are located exactly below the central lines of the conveying cavity, the coating photoresistor cavity, the photoetching cavity and the first sliding guide groove. The equipment is simple in structure, is convenient to operate, is precise in processing, and improves the processing efficiency and effect of the integrated chip.

Description

technical field [0001] The invention relates to the technical field of integrated chip processing, in particular to a semi-finished integrated chip production equipment. Background technique [0002] At present, integrated chips have become the essential core electronic components of global electronic products. There are also certain strict requirements for the processing of integrated chips. General and traditional integrated chip packaging equipment adopt rough processing procedures and complicated operations, which will cause irreversible effects. , the inappropriate coordination between each process affects the performance of the chip. At the same time, due to the unstable processing position, the effect of each process is not good, and the circuit breaks or short circuits between layers. Therefore, there is an urgent need for a semi-finished integrated chip production equipment. . Contents of the invention [0003] The technical problem to be solved by the present in...

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Problems solved by technology

[0002] At present, integrated chips have become the essential core electronic components of global electronic products. There are also certain strict requirements for the processing of integrated chips. General and traditional integrated chip packaging equipment adopt rough processing procedures and complicated operations, which will cause irreversible effects. , the inappropriate coordination between the various processes affects the performance of the chip. At the same time, due to the unstable processing position, the effect of each process is not good, and the circuits of each layer are broken or short-circuited. Therefore, there is an urgent need for a semi-finished integrated chip production equipment.

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