Electronic component heat dissipation structure

Abstract

The invention discloses an electronic component heat dissipation structure. The electronic component heat dissipation structure comprises a conductive coating layer, an exhausting fan, soldering tin layer plug pins and a ground pin; a surrounding plate is mounted at the top end of a heat dissipation apparatus main body; a circuit board is arranged in the surrounding plate; the conductive coating layer is arranged at the top end of the circuit board; mounting grooves are formed in the circuit board; the soldering tin layer plug pins are mounted in the mounting grooves; electronic components aremounted at the top ends of the soldering tin layer plug pins; conductive foamy cotton is mounted at each of the left end and the right end of the conductive coating layer separately; and the ground pin passes through a filtering net and the surrounding plate to be connected with the foamy cotton. By virtue of the electronic component heat dissipation structure, heat generated in operation and interference of electrostatic to the electronic components can be highly reduced, and the working efficiency and the service life of the electronic component heat dissipation structure are improved and prolonged; and by virtue of matched use of the mounting grooves and the soldering tin layer plug pins, the soldering tin layer plug pins can be in direct with electric soldering iron for welding when the electronic components are in fault and need to be re-welded, so that the electronic component heat dissipation structure is convenient to use.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a heat dissipation structure for electronic components. Background technique [0002] With the development of science and technology, electronic components are used more and more widely, and the development of electronic components has become an important symbol of the development of modern science and technology. Electronic components include resistors, capacitors, potentiometers, Electronic tubes, radiators, electromechanical components and electronic chemical materials and parts, etc.; although there are a large number of electronic components on the market, the heat dissipation and electrostatic interference problems of electronic components have always plagued the development of technology, and the current electronic components Most of the devices do not have heat dissipation and anti-static functions, but only have the most basic functions, which makes the use...

AI Technical Summary

Problems solved by technology

[0002] With the development of science and technology, electronic components are used more and more widely, and the development of electronic components has become an important symbol of the development of modern science and technology. Electronic components include resistors, capacitors, potentiometers, Electronic tubes, radiators, electromechanical components and electronic chemical materials and parts, etc.; although there are a large number of electronic components on the market, the heat dissipation and electrostatic interference problems of electronic components have always plagued the development of technology, and the current electronic components Most of the devices do not have heat dissipation and anti-static functions, but only have the most basic functions, which makes the use of electronic components and devices troublesome due to heat dissipation and static electricity problems, which not only reduces the service life of the equipment but also reduces the working time. Efficiency, the heat dissipation and anti-static effect of the existing heat-dissipating and anti-static electronic component devices are not very good, and it is easy to fall into dust, resulting in a lower service life of the device

Therefore, the requirement is not met

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