Manufacturing method of multilayer printed board embedded resistor

Abstract

The present invention provides a manufacturing method of a multilayer printed board embedded resistor by using a screen printing resistor paste. The method comprises the following steps: in the manufacturing process of an inner layer board of a multilayer printed board, before the circuit(s) are manufactured on the inner layer board, required resistance patterns are etched on an inner layer boardcopper foil; the resistor paste of a prescribed square resistance value is subjected to screen printing on the resistance patterns; and after pre-drying, mechanical polish-brush and post curing, the other circuit patterns are manufactured to form the inner layer board embedded with resistor(s) of the specific resistance value. According to the method, the problems of irregular border and uneven thickness in a conventional screen printing resistor are avoided, the method is easy to operate, the resistance value is easy to control, the production efficiency and quality of the multilayer printedboard embedded resistor are improved, the assembly density is improved, and the production requirements of lightness, thinness, shortness and minimization of electronic products are satisfied.

Description

technical field [0001] The invention relates to the field of making special printed boards, including in the process of making inner layer boards of multilayer printed boards. Resistor pattern, and then screen-print the resistor paste with specified square resistance value on the resistor pattern, after pre-baking, mechanical grinding, post-curing and other circuit pattern production, to form a multi-layer printed board embedded with specific resistance value resistors Use the inner layer board, and then complete the inner layer board with embedded resistors and circuit patterns, together with other supporting inner layer boards and auxiliary bonding materials, make a multilayer printed board with embedded resistors according to the conventional multilayer printed board production process . [0002] The invention improves the precision of the resistance value of the embedded resistance made by screen printing resistance paste, reduces the workload of resistance value correcti...

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is to provide a method for making embedded resistors in multi-layer printed boards by screen printing resistor paste with simple process and reliable quality, which can produce embedded resistor patterns with high precision in position and size, and controllable resistance , to avoid problems such as uneven resistor edges, uneven thickness, and heavy resistance correction workload, etc., and a smaller square resistor size can be selected to reduce the size of the resistor pattern while meeting the resistance value requirements, thereby increasing the wiring density. It meets the requirements of modern electronic products, which are light, thin and short, and is especially suitable for the production of small IoT sensors and electronic products for microsystems in the future.

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