Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor element and device having same

A technology of semiconductors and components, applied in the field of semiconductor components, can solve problems such as insufficient reliability, influence of PUF array size, large size, etc.

Active Publication Date: 2020-11-10
MACRONIX INT CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the structure of SRAM PUF (for example, including 6 transistors) occupies a large size, which will affect the reduction of the size of the PUF array.
Furthermore, SRAM PUF is easily affected by environmental factors, for example, SRAM PUF is affected by temperature changes and voltage level changes (such as power supply voltage V DD ) is quite sensitive to interference caused by
The hamming distances between SRAM PUFs will increase with increasing temperature, resulting in an increase in the bit error rate (BER)
Therefore, although SRAM PUF can provide irregular and unique PUF applications, the lack of reliability due to the noise induced instability mentioned above is one of the main concerns of SRAM PUF applications

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor element and device having same
  • Semiconductor element and device having same
  • Semiconductor element and device having same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] According to an embodiment of the present invention, a semiconductor device is proposed, including a programmable memory array, such as a programmable memory array with a physically unclonable function (PUF). The PUF programmable memory array of the embodiment can effectively Increase the reliability of PUF application. A number of implementation aspects proposed by the present invention are described below with reference to the accompanying drawings to describe related configurations and manufacturing methods. Relevant structural details such as relevant layers and spatial configurations are described in the following embodiments, and one aspect of applying the PUF programmable memory array of the embodiment to a chip is taken as an example for illustration. However, the present invention is not limited to the content and aspects, and the present invention does not show all possible embodiments, and other implementation aspects not proposed in the present invention may...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

A semiconductor element, comprising a programmable memory array, including a plurality of memory cells disposed above a substrate, one of the memory cells includes: a gate disposed above the substrate; a conductive portion separated from the gate and a dielectric layer, contacting the conductive part and separated from the gate, the dielectric layer defines a threshold voltage of the memory cell, wherein at least two memory cells have different threshold voltages.

Description

technical field [0001] The present invention relates to a semiconductor device and a device including the semiconductor device, and in particular to a semiconductor device with a physically unclonable function (PUF) and a device including the semiconductor device. Background technique [0002] A physically unclonable function (PUF) is a hardware intrinsic security technology (hardware intrinsic security, HIS), which can generate a chip "fingerprint" to construct a security authentication mechanism. Applying PUF prevents physical attacks that attempt to steal digital information from the chip. Static Random-Access Memory (SRAM) is one of the common implementation aspects of PUF applications, which utilizes critical voltage differences in power supply states to generate chip identifiers. However, the structure of the SRAM PUF (including 6 transistors, for example) occupies a large size, which will affect the reduction of the size of the PUF array. Furthermore, SRAM PUF is ea...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/24H01L23/00
CPCH01L23/57H10B63/80
Inventor 曾柏皓许凯捷
Owner MACRONIX INT CO LTD