A kind of array copper oxide semiconductor sensor and its preparation method and application

Abstract

The invention discloses an array copper oxide semiconductor sensor and a preparation method. According to the method, conductive layer pattern printing is performed on a substrate by using no-particlecopper ink, then the special patterns for growth of copper oxide are printed on the conductive layer after thermal treatment, and growth of the metal oxide fiber array is realized on the patterns forgrowth of the copper oxide through thermal treatment so that printing of the semiconductor layer patterns can be realized. According to the method, pattern printing can be performed on the surface ofthe flexible substrate and the non-planar complex substrate without the mask plate, the proportion of the copper oxide and the cuprous oxide and the dimension and the density of the fibers in the metal oxide fiber array can be regulated and controlled by controlling the thermal treatment condition, and interface bonding between the generated copper oxide and the metal copper (the conductive layerpatterns for growth of the copper oxide) is great so as to have great advantages in the aspect of wearable equipment and flexible electronics.

Description

technical field [0001] The invention relates to an array copper oxide semiconductor sensor, a preparation method and application thereof, and belongs to the technical field of sensors. Background technique [0002] Metal oxide semiconductors will have conductivity changes in special sound, light, heat and atmosphere environments, so they are often used in gas-sensitive, humidity-sensitive, light-sensitive and other sensors. Semiconductors with nanofiber array structures have attracted extensive attention due to their advantages such as high electronic conductivity, surface activity, and large specific surface area. At present, methods such as chemical vapor deposition and electrospinning are mostly used to prepare fiber array semiconductors, which require expensive equipment, and masks are also required when applied to integrated devices. [0003] In recent years, inkjet printing has attracted attention for its advantages of no mask, non-contact, direct printing, less steps...

AI Technical Summary

Problems solved by technology

There have been many reports on the preparation of sensor elements by printing methods, but most of them are printed nanoparticle inks. Although there are a small number of reports on particle-free inks, and the reported semiconductor films obtained by sintering particle-free inks are mostly composed of particles. There are still differences from devices composed of fiber array structure oxide semiconductors

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