Double-layer buffer welding mechanism for solar wafer module welding

A technology of solar wafers and welding mechanisms, applied in welding equipment, auxiliary welding equipment, welding/cutting auxiliary equipment, etc., can solve problems such as over-welding, affecting welding quality, inconsistent contact state between solder joints and welding heads, etc., to reduce virtual Welding and missing welding, the effect of improving welding quality

Pending Publication Date: 2018-09-25
合肥瑞硕科技有限公司
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  • Claims
  • Application Information

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Problems solved by technology

[0003] In the current solar module welding technology, there are still the following obvious defects: 1. The contact state between each solder joint and the welding head is inconsistent, resulting in vi

Method used

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  • Double-layer buffer welding mechanism for solar wafer module welding
  • Double-layer buffer welding mechanism for solar wafer module welding
  • Double-layer buffer welding mechanism for solar wafer module welding

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] see Figure 1-3 , the present invention provides a technical solution:

[0021] A double-layer buffer welding mechanism for welding solar wafer components, comprising:

[0022] The bottom plate 1 is provided with a linear slide rail 4 on one side, and the upper and lower parts of the linear slide rail 4 are respectively provided with an upper limit block 2 and a lower limit block 6. The upper limit block 2 is vertically arranged on the left side of the...

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Abstract

The invention discloses a double-layer buffer welding mechanism for solar wafer module welding. The double-layer buffer welding mechanism comprises a bottom plate and a clamping block, wherein an upper limiting block and a lower limiting block are respectively arranged on the upper part and the lower part of a linear sliding rail; one end of the clamping block is arranged on the linear sliding rail in a sliding manner, and a welding gun is fixedly arranged at the other end of the clamping block; a first buffer spring and a supporting block are respectively arranged between the clamping block and the upper limiting block and the lower limiting block; a driving device used for driving the clamping block to move is arranged on the clamping block; a clamping plate is fixedly arranged on a sideface of a connecting plate; and a steel wire for holding the grid line is arranged at the lower end of the clamping plate. According to the arrangement of the steel wire and the second buffer spring,the grid line is held by the steel wire in the welding process, the holding grid is reinforced by the second buffer spring, and each welding spot can be held. Due to the arrangement of the first buffer spring, upper and lower spots of each welding gun are reinforced, each welding spot can be welded, the probability of insufficient solder and missing solder can be effectively reduced, and the welding quality is improved.

Description

technical field [0001] The invention relates to the technical field of solar module welding equipment, in particular to a double-layer buffer welding mechanism for solar wafer component welding. Background technique [0002] In recent years, with the rapid development of the photovoltaic industry, the production of solar modules has been greatly promoted. In the production process of solar modules, the welding of solar modules has become a key process in the whole production process, and the quality and efficiency of welding directly affect the reliability of solar modules. [0003] In the current solar module welding technology, there are still the following obvious defects: 1. The contact state between each solder joint and the welding head is inconsistent, resulting in virtual welding and over welding; 2. The grid line is easy to affect the position of the solder joint, making each solder joint The position of the point is not uniform, which affects the welding quality. ...

Claims

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Application Information

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IPC IPC(8): B23K37/00B23K37/04B23K37/02
CPCB23K37/00B23K37/02B23K37/0443
Inventor 林宏俊苏文章
Owner 合肥瑞硕科技有限公司
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