Double-layer one-side copper-based circuit board making process

A manufacturing process and circuit board technology, applied in printed circuit manufacturing, printed circuit, printed circuit secondary processing, etc., can solve the problems of FR4 panel oil loss, blind hole copper layer cracking, easy delamination and blistering, etc., to avoid The effect of oil loss, avoiding blind hole cracking, and avoiding cracking

Active Publication Date: 2018-10-02
ZHUHAI KINGROAD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Adopting ordinary pressed copper-based hollow board process will result in poor reliability and easy layering and blistering; the FR4 panel will lose oil to a large

Method used

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  • Double-layer one-side copper-based circuit board making process

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Example Embodiment

[0020] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0021] Such as figure 1 As shown, a double-layer single-sided copper-based circuit board. The manufacturing process of the double-layer single-sided copper-based circuit board includes the following steps a to e.

[0022] Step a: Cut according to the process size to obtain FR4 board 1. FR4 board 1 includes FR4 core material layer 12 and copper layers arranged on both sides of the core material layer. FR4 board 1 is baked at a temperature of 135 to 165°C. Board time 3.6~4.5h; single-sided copper sinking on FR4 board 1 to obtain a thicker inner copper layer.

[0023] The copper layer is thickened on the baking sheet, and the thickened inner layer has a stable copper structure, which is not easy to layer, and is not easy to form copper skin and bubbles; the inner layer circuit 11 has a stable structure and an enlarged size, and the current c...

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PUM

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Abstract

The invention discloses a double-layer one-side copper-based circuit board making process comprising the following steps: baking a FR4 board, obtaining an internal layer line on the FR4 board, and silkprinting a solder mask on the internal layer line; stacking a plurality of slots and/or vias on a copper base, and placing a high temperature glue film or release film below slot/via on the copper base; laminating the FR4 board, a bonding sheet and the copper base at a high temperature; drilling blind holes on the FR4 board, electroplating copper on the FR4 board and etching same, thus obtainingan external layer line. The high temperature glue film or release film are placed on hollow positions before lamination, thus increasing lamination buffer force, and effectively preventing the soldermask from dropping oil under ununiform lamination of the board; the process can prevent the circuit board from layering and foaming via the board baking and pad high temperature lamination; a dry filmof 45-55 um is selected so as to fully cover the blind holes, thus preventing blind hole broken caused by developing and etching, and preventing the copper layer from being broken.

Description

technical field [0001] The invention relates to a circuit board, in particular to a manufacturing process of a double-layer single-side copper-based circuit board. Background technique [0002] In the ordinary MPCB double-layer one-sided lamination process, it is sufficient to laminate FR4 and the metal base. Adopting ordinary pressed copper-based hollow board process will result in poor reliability and easy layering and blistering; the FR4 panel will lose oil to a large extent after pressing; when making circuit film, there will be a large area of ​​serious holes after development, which will lead to The copper layer of the blind via is cracked. Contents of the invention [0003] In order to overcome the deficiencies of the prior art, the object of the present invention is to provide a manufacturing process for a double-layer single-side copper-based circuit board, so as to improve the quality of the circuit board. [0004] The technical scheme that the present inventio...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/28
CPCH05K3/0094H05K3/281H05K2203/111
Inventor 徐建华
Owner ZHUHAI KINGROAD ELECTRONICS
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